W66BQ6 Series

Catalog

IC DRAM 2GBIT LVSTL 11 200WFBGA

Part	Voltage - Supply [Min]	Voltage - Supply [Max]	Memory Interface	Access Time	Memory Organization	Write Cycle Time - Word, Page	Package / Case	Mounting Type	Clock Frequency	Supplier Device Package	Operating Temperature [Min]	Operating Temperature [Max]	Memory Size	Technology	Memory Format	Memory Type
Winbond Electronics W66BQ6NBUAFJ TR	1.06 V 1.7 V	1.17 V 1.95 V	LVSTL_11	3.5 ns	128M x 16	18 ns	200-WFBGA	Surface Mount	1600 MHz	200-WFBGA (10x14.5)	-40 °C	105 °C	2 Gbit	SDRAM - Mobile LPDDR4X	DRAM	Volatile
Winbond Electronics W66BQ6NBUAGJ	1.06 V 1.7 V	1.17 V 1.95 V	LVSTL_11	3.5 ns	128M x 16	18 ns	200-WFBGA	Surface Mount	1866 MHz	200-WFBGA (10x14.5)	-40 °C	105 °C	2 Gbit	SDRAM - Mobile LPDDR4X	DRAM	Volatile
Winbond Electronics W66BQ6NBQAGJ	1.06 V 1.7 V	1.17 V 1.95 V	LVSTL_06	3.6 ns	128M x 16	18 ns	200-TFBGA	Surface Mount	1.867 GHz	200-TFBGA (10x14.5)	-40 °C	105 °C	2 Gbit	SDRAM - Mobile LPDDR4X	DRAM	Volatile
Winbond Electronics W66BQ6NBUAGJ TR	1.06 V 1.7 V	1.17 V 1.95 V	LVSTL_11	3.5 ns	128M x 16	18 ns	200-WFBGA	Surface Mount	1866 MHz	200-WFBGA (10x14.5)	-40 °C	105 °C	2 Gbit	SDRAM - Mobile LPDDR4X	DRAM	Volatile
Winbond Electronics W66BQ6NBUAFJ	1.06 V 1.7 V	1.17 V 1.95 V	LVSTL_11	3.5 ns	128M x 16	18 ns	200-WFBGA	Surface Mount	1600 MHz	200-WFBGA (10x14.5)	-40 °C	105 °C	2 Gbit	SDRAM - Mobile LPDDR4X	DRAM	Volatile
Winbond Electronics W66BQ6NBUAHJ	1.06 V 1.7 V	1.17 V 1.95 V	LVSTL_11	3.5 ns	128M x 16	18 ns	200-WFBGA	Surface Mount	2.133 GHz	200-WFBGA (10x14.5)	-40 °C	105 °C	2 Gbit	SDRAM - Mobile LPDDR4X	DRAM	Volatile