SPHWHAHDNM251 Series
Manufacturer: Samsung Semiconductor, Inc.
LED COB D GEN2 NEUT WHT SQ 4000K
| Part | Temperature - Test | Viewing Angle | Size / Dimension [y] | Size / Dimension [x] | Luminous Flux @ Current/Temperature | Voltage - Forward (Vf) (Typ) | Current - Max [Max] | Color | Type | CRI (Color Rendering Index) | Current - Test | Lens Type | Height [z] | CCT (K) | CCT (K) | Lumens/Watt @ Current - Test | Light Emitting Surface (LES) [diameter] | Configuration |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung Semiconductor, Inc. | 85 °C | 115 ° | 28 mm | 28 mm | 13123 lm | 51.1 V | 3.24 A | Neutral White | Chip On Board (COB) | 80 | 1.62 A | Flat | 1.5 mm | 4000 K | 3-Step MacAdam Ellipse | 159 lm/W | 22 mm | Square |
Samsung Semiconductor, Inc. | 85 °C | 115 ° | 28 mm | 28 mm | 52 V | 2.76 A | Warm White | Chip On Board (COB) | 80 | 1.62 A | Flat | 1.5 mm | 2700 K | 3-Step MacAdam Ellipse | 126 lm/W | 22 mm | Square | |
Samsung Semiconductor, Inc. | 85 °C | 115 ° | 28 mm | 28 mm | 14199 lm | 50.5 V | 4.14 A | Neutral White | Chip On Board (COB) | 80 | 1.62 A | Flat | 1.7 mm | 4000 K | 3-Step MacAdam Ellipse | 174 lm/W | 22 mm | Square |
Samsung Semiconductor, Inc. | 85 °C | 115 ° | 28 mm | 28 mm | 13069 lm | 50 V | 4.14 A | Warm White | Chip On Board (COB) | 80 | 1.62 A | Flat | 1.5 mm | 3000 K | 3-Step MacAdam Ellipse | 161 lm/W | 22 mm | Square |
Samsung Semiconductor, Inc. | 85 °C | 115 ° | 28 mm | 28 mm | 13452 lm | 50 V | 4.14 A | Warm White | Chip On Board (COB) | 80 | 1.62 A | Flat | 1.5 mm | 3500 K | 166 lm/W | 22 mm | Square | |
Samsung Semiconductor, Inc. | 85 °C | 115 ° | 28 mm | 28 mm | 13196 lm | 51.1 V | 3.24 A | Cool White | Chip On Board (COB) | 80 | 1.62 A | Flat | 1.5 mm | 5000 K | 3-Step MacAdam Ellipse | 159 lm/W | 22 mm | Square |
Samsung Semiconductor, Inc. | 85 °C | 115 ° | 28 mm | 28 mm | 13735 lm | 3.24 A | Neutral White | Chip On Board (COB) | 80 | 1.62 A | Flat | 1.5 mm | 4000 K | 3-Step MacAdam Ellipse | 168 lm/W | 22 mm | Square | |
Samsung Semiconductor, Inc. | 85 °C | 115 ° | 28 mm | 28 mm | 13126 lm | 51.1 V | 3.24 A | Cool White | Chip On Board (COB) | 80 | 1.62 A | Flat | 1.5 mm | 5700 K | 3-Step MacAdam Ellipse | 159 lm/W | 22 mm | Square |
Samsung Semiconductor, Inc. | 85 °C | 115 ° | 28 mm | 28 mm | 12468 lm | 52 V | 4.14 A | Warm White | Chip On Board (COB) | 80 | 1.62 A | Flat | 1.5 mm | 3000 K | 3-Step MacAdam Ellipse | 148 lm/W | 22 mm | Square |
Samsung Semiconductor, Inc. | 85 °C | 115 ° | 28 mm | 28 mm | 11533 lm | 52 V | 2.76 A | Warm White | Chip On Board (COB) | 80 | 1.62 A | Flat | 1.5 mm | 3500 K | 3-Step MacAdam Ellipse | 137 lm/W | 22 mm | Square |