
66AK2L06 Series
Manufacturer: Texas Instruments

MULTICORE DSP+ARM KEYSTONE II SYSTEM-ON-CHIP (SOC)
| Part | Interface | Operating Temperature [Max] | Operating Temperature [Min] | Voltage - Core | Mounting Type | Non-Volatile Memory | On-Chip RAM | Type | Package / Case | Voltage - I/O | Supplier Device Package | Clock Rate |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments | DMA EBI/EMI Ethernet I2C PCIe SPI UART/USART USB 3.0 USIM | 100 °C | 0 °C | Variable | Surface Mount | 384 kB | 5.384 MB | DSP+ARM® | 900-BFBGA FCBGA | 0.85 V 1 V 1.8 V 3.3 V | 900-FCBGA (25x25) | 1.2 GHz |
Texas Instruments | DMA EBI/EMI Ethernet I2C PCIe SPI UART/USART USB 3.0 USIM | 100 °C | 0 °C | Variable | Surface Mount | 384 kB | 5.384 MB | DSP+ARM® | 900-BFBGA FCBGA | 0.85 V 1 V 1.8 V 3.3 V | 900-FCBGA (25x25) | |
Texas Instruments | DMA EBI/EMI Ethernet I2C PCIe SPI UART/USART USB 3.0 USIM | 100 °C | -40 °C | Variable | Surface Mount | 384 kB | 5.384 MB | DSP+ARM® | 900-BFBGA FCBGA | 0.85 V 1 V 1.8 V 3.3 V | 900-FCBGA (25x25) | 1.2 GHz |
Texas Instruments | DMA EBI/EMI Ethernet I2C PCIe SPI UART/USART USB 3.0 USIM | 100 °C | -40 °C | Variable | Surface Mount | 384 kB | 5.384 MB | DSP+ARM® | 900-BFBGA FCBGA | 0.85 V 1 V 1.8 V 3.3 V | 900-FCBGA (25x25) |