W66BP2 Series
Manufacturer: Winbond Electronics
IC DRAM 2GBIT LVSTL 11 200TFBGA
| Part | Memory Type | Supplier Device Package | Package / Case | Write Cycle Time - Word, Page | Memory Size | Clock Frequency | Mounting Type | Memory Organization | Memory Format | Operating Temperature [Min] | Operating Temperature [Max] | Memory Interface | Voltage - Supply [Min] | Voltage - Supply [Max] | Access Time | Technology |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | Volatile | 200-TFBGA (10x14.5) | 200-TFBGA | 18 ns | 2 Gbit | 2.133 GHz | Surface Mount | 64 M | DRAM | -40 °C | 105 °C | LVSTL_11 | 1.06 V 1.7 V | 1.17 V 1.95 V | 3.6 ns | SDRAM - Mobile LPDDR4 |
Winbond Electronics | Volatile | 200-TFBGA (10x14.5) | 200-TFBGA | 18 ns | 2 Gbit | 1600 MHz | Surface Mount | 64 M | DRAM | -40 °C | 105 °C | LVSTL_11 | 1.06 V 1.7 V | 1.17 V 1.95 V | 3.6 ns | SDRAM - Mobile LPDDR4 |