SMD Indust X7R HT175C Series
Manufacturer: KEMET
MULTILAYER CERAMIC CAPACITORS MLCC - SMD/SMT 50V 0.1UF X7R 0603 10%
| Part | Applications | Operating Temperature [Max] | Operating Temperature [Min] | Features | Temperature Coefficient | Package / Case | Package / Case | Capacitance | Voltage - Rated | Thickness (Max) [Max] | Thickness (Max) [Max] | Size / Dimension [y] | Size / Dimension [x] | Size / Dimension [y] | Size / Dimension [x] | Tolerance | Mounting Type | Size / Dimension [y] | Thickness (Max) [Max] [custom] | Thickness (Max) [Max] [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
KEMET | Bypass Decoupling General Purpose | 175 °C | -55 C | High Temperature | X7R | 1608 Metric | 0603 | 100000 pF | 50 VDC | 0.034 " | 0.87 mm | 0.031 in | 1.6 mm | 0.8 mm | 0.063 " | 10 % | MLCC Surface Mount | |||
KEMET | Boardflex Sensitive Bypass Decoupling | 175 °C | -55 C | High Temperature Soft Termination | X7R | 0805 | 0.68 µF | 25 VDC | 0.055 in | 1.4 mm | 0.049 " | 2 mm | 0.079 in | 10 % | MLCC Surface Mount | 1.25 mm | ||||
KEMET | Boardflex Sensitive Bypass Decoupling | 175 °C | -55 C | High Temperature Soft Termination | X7R | 3225 Metric | 1210 | 2.2 µF | 25 VDC | 0.091 in | 2.3 mm | 0.102 in | 3.3 mm | 0.13 " | 10 % | MLCC Surface Mount | 2.6 mm | |||
KEMET | Boardflex Sensitive Bypass Decoupling | 175 °C | -55 C | High Temperature Soft Termination | X7R | 1812 (4532 Metric) | 3.3 µF | 25 VDC | 0.126 in | 4.5 mm | 0.177 in | 10 % | MLCC Surface Mount | 3.2 mm | 0.083 " | 2.1 mm |