2.00mm Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.051µm Gold (Au) Plating, without Locating Peg, 24 Circuits, Lead-Free
2.00mm Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.051µm Gold (Au) Plating, without Locating Peg, 24 Circuits, Lead-Free
2.00mm Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.051µm Gold (Au) Plating, without Locating Peg, 24 Circuits, Lead-Free
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Mating | Contact Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Contact Shape | Insulation Material | Row Spacing - Mating | Row Spacing - Mating | Contact Type | Current Rating (Amps) | Number of Positions Loaded | Pitch - Mating [x] | Pitch - Mating [x] | Number of Rows | Fastening Type | Insulation Color | Number of Positions | Insulation Height [custom] | Insulation Height [custom] | Contact Finish - Post | Mounting Type | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Voltage Rating | Connector Type | Features | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Molex | 105 ░C | -55 °C | Gold | Copper Alloy | 15 µin | 0.38 µm | UL94 V-0 | Square | Polyamide (PA46) Nylon 4/6 | 0.079 in | 2 mm | Female Socket | 1.9 A | All | 0.079 in | 2 mm | 2 | Push-Pull | Black | 8 | 0.157 in | 4 mm | Tin | Surface Mount | Solder | 1.27 µm | 50 µin | 125 VDC | Receptacle | Board Guide Pick and Place | Automotive General Purpose Telecommunications |
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