FFSH20120ADN-F155 Series
Silicon Carbide (SiC) Schottky Diode – EliteSiC, 20 A, 1200 V, D1, TO-247-3L
Manufacturer: ON Semiconductor
Catalog
Silicon Carbide (SiC) Schottky Diode – EliteSiC, 20 A, 1200 V, D1, TO-247-3L
| Part | Grade | Current - Average Rectified (Io) | Qualification | Reverse Recovery Time (trr) | Voltage - DC Reverse (Vr) (Max) [Max] | Package / Case | Operating Temperature - Junction [Max] | Operating Temperature - Junction [Min] | Speed | Capacitance @ Vr, F | Current - Reverse Leakage @ Vr | Technology | Supplier Device Package | Mounting Type | Voltage - Forward (Vf) (Max) @ If | Diode Configuration | Current - Average Rectified (Io) (per Diode) | Speed |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ON Semiconductor | Automotive | 30 A | AEC-Q101 | 0 ns | 1.2 kV | TO-247-2 | 175 ░C | -55 C | No Recovery Time | 1220 pF | 200 µA | SiC (Silicon Carbide) Schottky | TO-247-2 | Through Hole | ||||
ON Semiconductor | Automotive | 15 A | AEC-Q101 | 0 ns | 1.2 kV | TO-247-3 | 175 ░C | -55 C | No Recovery Time | 612 pF | 200 µA | SiC (Silicon Carbide) Schottky | TO-247-3 | Through Hole | ||||
ON Semiconductor | 1.2 kV | TO-247-3 | 175 ░C | -55 C | 200 µA | SiC (Silicon Carbide) Schottky | TO-247-3 | Through Hole | 1.75 V | 1 Pair Common Cathode | 10 A | 200 mA 500 ns |
Key Features
• Max Junction Temperature 175 °C
• Avalanche Rated 100 mJ
• High Surge Current Capacity
• Positive Temperature Coefficient
• Ease of Paralleling
• No Reverse Recovery / No Forward Recovery
• AEC-Q101 qualified and PPAP Capable
Description
AI
Silicon Carbide (SiC) Schottky Diodes use a completely new technology that provides superior switching performance and higher reliability to silicon. No reverse recovery current, temperature independent switching characteristics, and excellent thermal performance sets Silicon Carbide as the next generation of power semiconductor. System benefits include highest efficiency, faster operating frequency, increased power density, reduced EMI, and reduced system size and cost.