CC2564MODN Series
Bluetooth® 4.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE) module
Manufacturer: Texas Instruments
Catalog
Bluetooth® 4.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE) module
| Part | Voltage - Supply [Min] | Voltage - Supply [Max] | Protocol | Power - Output | Frequency | Modulation | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Type | Package / Case | Current - Transmitting | Supplier Device Package | RF Family/Standard | Serial Interfaces | Current - Receiving [Min] | Current - Receiving [Max] | Sensitivity | Data Rate (Max) | Current - Transmitting [Max] | Current - Transmitting [Min] | Utilized IC / Part | Antenna Type | Data Rate | For Use With/Related Products | Supplied Contents |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments | 1.7 V | 4.8 V | Bluetooth v4.2 | 10 dBm | 2.4 GHz | 8DPSK DQPSK GFSK | Surface Mount | 85 °C | -40 °C | TxRx + MCU | 76-VQFN Dual Rows Exposed Pad | 112.5 mA | 76-VQFNP-MR (8x8) | Bluetooth | UART | |||||||||||
 Texas Instruments | 2.2 V | 4.8 V | Bluetooth v4.0 | 12 dBm | 2.4 GHz | GFSK GMSK | Surface Mount | 85 °C | -40 °C | TxRx Only | 76-VQFN Dual Rows Exposed Pad | 76-VQFNP-MR (8x8) | Bluetooth | I2S UART | 40.5 mA | 41.2 mA | -95 dBm | 4 Mbps | 41.2 mA | 40.5 mA | ||||||
Texas Instruments | 2.2 V | 4.8 V | Bluetooth v4.0 | 12 dBm | 2.4 GHz | GFSK GMSK | Surface Mount | 85 °C | -40 °C | TxRx Only | 76-VQFN Dual Rows Exposed Pad | 76-VQFNP-MR (8x8) | Bluetooth | I2S UART | 40.5 mA | 41.2 mA | -95 dBm | 4 Mbps | 41.2 mA | 40.5 mA | ||||||
 Texas Instruments | 2.2 V | 4.8 V | Bluetooth v4.1 | 10 dBm | 2.4 GHz | Surface Mount | 85 °C | -30 ░C | 33-SMD Module | 112.5 mA | Bluetooth | I2S UART | -93 dBm | CC2564 | Antenna Not Included | 4 Mbps | ||||||||||
 Texas Instruments | 2.2 V | 4.8 V | Bluetooth v4.0 | 12 dBm | 2.4 GHz | GFSK GMSK | Surface Mount | 85 °C | -40 °C | TxRx Only | 54-UFBGA DSBGA | 54-DSBGA (2.93x3.27) | Bluetooth | I2S UART | 40.5 mA | 41.2 mA | -95 dBm | 4 Mbps | 41.2 mA | 40.5 mA | ||||||
Texas Instruments | 2.2 V | 4.8 V | Bluetooth v4.1 | 10 dBm | 2.4 GHz | Surface Mount | 85 °C | -30 ░C | 33-SMD Module | 112.5 mA | Bluetooth | I2S UART | -93 dBm | CC2564 | Antenna Not Included | 4 Mbps | ||||||||||
Texas Instruments | 2.2 V | 4.8 V | Bluetooth v4.0 | 12 dBm | 2.4 GHz | GFSK GMSK | Surface Mount | 85 °C | -40 °C | TxRx Only | 54-UFBGA DSBGA | 54-DSBGA (2.93x3.27) | Bluetooth | I2S UART | 40.5 mA | 41.2 mA | -95 dBm | 4 Mbps | 41.2 mA | 40.5 mA | ||||||
 Texas Instruments | 2.4 GHz | Transceiver; Bluetooth® Smart Ready 4.x Dual Mode (BLE) | CC2564 | Board(s) | ||||||||||||||||||||||
 Texas Instruments | 2.4 GHz | Transceiver; Bluetooth® Smart Ready 4.x Dual Mode (BLE) | CC2564 | Board(s) | ||||||||||||||||||||||
Texas Instruments | 2.2 V | 4.8 V | Bluetooth v4.1 | 12 dBm | 2.4 GHz | GFSK GMSK | Surface Mount | 85 °C | -40 °C | TxRx Only | 54-UFBGA DSBGA | 54-DSBGA (2.93x3.27) | Bluetooth | I2S UART | 40.5 mA | 41.2 mA | -95 dBm | 4 Mbps | 41.2 mA | 40.5 mA |
Key Features
• Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:CC2564MODA With Integrated AntennaCC2564MODN With External AntennaFully Certified Module for FCC, IC, CE, and Bluetooth 4.1FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI LayerHighly Optimized for Design Into Small Form Factor Systems and Flexibility:CC2564MODAIntegrated Chip AntennaModule Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)CC2564MODNSingle-Ended 50-Ω RF InterfaceModule Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)BR and EDR Features Include:Up to Seven Active DevicesScatternet: Up to Three Piconets Simultaneously, One as Master and Two as SlavesUp to Two Synchronous Connection Oriented (SCO) Links on the Same PiconetSupport for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and PowerSupport of Multiple Bluetooth Profiles With Enhanced QoSLow Energy Features Include:Support of up to 10 Simultaneous ConnectionsMultiple Sniff Instances Tightly Coupled to Achieve Minimum Power ConsumptionIndependent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR PerformanceBuilt-In Coexistence and Prioritization Handling for BR, EDR, and Low EnergyBest-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)Class 1.5 TX Power up to +10 dBm–93 dbm Typical RX SensitivityInternal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration RequiredImproved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation TimeProvides Longer Range, Including Twice the Range of Other Low-Energy-Only SolutionsAdvanced Power Management for Extended Battery Life and Ease of DesignOn-Chip Power Management, Including Direct Connection to BatteryLow Power Consumption for Active, Standby, and Scan Bluetooth ModesShutdown and Sleep Modes to Minimize Power ConsumptionPhysical Interfaces:UART Interface With Support for Maximum Bluetooth Data RatesUART Transport Layer (H4) With Maximum Rate of 4 MbpsThree-Wire UART Transport Layer (H5) With Maximum Rate of 4 MbpsFully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec InterfaceCC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service PackAll trademarks are the property of their respective owners. All trademarks are the property of their respective owners.Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:CC2564MODA With Integrated AntennaCC2564MODN With External AntennaFully Certified Module for FCC, IC, CE, and Bluetooth 4.1FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI LayerHighly Optimized for Design Into Small Form Factor Systems and Flexibility:CC2564MODAIntegrated Chip AntennaModule Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)CC2564MODNSingle-Ended 50-Ω RF InterfaceModule Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)BR and EDR Features Include:Up to Seven Active DevicesScatternet: Up to Three Piconets Simultaneously, One as Master and Two as SlavesUp to Two Synchronous Connection Oriented (SCO) Links on the Same PiconetSupport for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and PowerSupport of Multiple Bluetooth Profiles With Enhanced QoSLow Energy Features Include:Support of up to 10 Simultaneous ConnectionsMultiple Sniff Instances Tightly Coupled to Achieve Minimum Power ConsumptionIndependent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR PerformanceBuilt-In Coexistence and Prioritization Handling for BR, EDR, and Low EnergyBest-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)Class 1.5 TX Power up to +10 dBm–93 dbm Typical RX SensitivityInternal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration RequiredImproved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation TimeProvides Longer Range, Including Twice the Range of Other Low-Energy-Only SolutionsAdvanced Power Management for Extended Battery Life and Ease of DesignOn-Chip Power Management, Including Direct Connection to BatteryLow Power Consumption for Active, Standby, and Scan Bluetooth ModesShutdown and Sleep Modes to Minimize Power ConsumptionPhysical Interfaces:UART Interface With Support for Maximum Bluetooth Data RatesUART Transport Layer (H4) With Maximum Rate of 4 MbpsThree-Wire UART Transport Layer (H5) With Maximum Rate of 4 MbpsFully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec InterfaceCC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service PackAll trademarks are the property of their respective owners. All trademarks are the property of their respective owners.
Description
AI
The CC2564MODx module from Texas Instruments™ is a complete Bluetooth®BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.
Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.
The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM®Cortex®-M3 and ARM®Cortex®-M4 MCUs, and Linux®based MPUs. Other processors can be supported through TI's third party. The iPod®(MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:
For more information, see TI Dual-Mode Bluetooth Stack.
In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.
The CC2564MODx module from Texas Instruments™ is a complete Bluetooth®BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.
Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.
The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM®Cortex®-M3 and ARM®Cortex®-M4 MCUs, and Linux®based MPUs. Other processors can be supported through TI's third party. The iPod®(MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:
For more information, see TI Dual-Mode Bluetooth Stack.
In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.