
CSD95481RWJ Series
60A Synchronous Buck NexFET™ Smart Power Stage in an Industry Standard Footprint
Manufacturer: Texas Instruments
Catalog
60A Synchronous Buck NexFET™ Smart Power Stage in an Industry Standard Footprint
Key Features
• 60-A Continuous Operating Current CapabilityOver 95% System Efficiency at 30 AHigh-Frequency Operation (up to 1.25 MHz)Diode Emulation FunctionTemperature Compensated Bi-Directional Current SenseAnalog Temperature OutputFault Monitoring3.3-V and 5-V PWM Signal CompatibleTri-State PWM InputIntegrated Bootstrap SwitchOptimized Dead Time for Shoot-Through ProtectionHigh-Density QFN 5-mm × 6-mm FootprintUltra-Low-Inductance PackageSystem Optimized PCB FootprintThermally Enhanced Topside CoolingRoHS Compliant – Lead-Free Terminal PlatingHalogen Free60-A Continuous Operating Current CapabilityOver 95% System Efficiency at 30 AHigh-Frequency Operation (up to 1.25 MHz)Diode Emulation FunctionTemperature Compensated Bi-Directional Current SenseAnalog Temperature OutputFault Monitoring3.3-V and 5-V PWM Signal CompatibleTri-State PWM InputIntegrated Bootstrap SwitchOptimized Dead Time for Shoot-Through ProtectionHigh-Density QFN 5-mm × 6-mm FootprintUltra-Low-Inductance PackageSystem Optimized PCB FootprintThermally Enhanced Topside CoolingRoHS Compliant – Lead-Free Terminal PlatingHalogen Free
Description
AI
The CSD95481RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.
The CSD95481RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.