501864 Series
Manufacturer: Molex
0.50MM PITCH EASY-ON FFC/FPC-TO-BOARD CONNECTOR, RECEPTACLE HOUSING ASSEMBLY, RIGHT-ANGLE, SURFACE MOUNT, WITHOUT GROUNDING TERMINALS, GOLD (AU) PLATING, 30 CIRCUITS
| Part | Flat Flex Type | Material Flammability Rating | Housing Color | Current Rating (Amps) | Contact Material | Voltage Rating | Height Above Board | Height Above Board | Contact Finish | Locking Feature | Mating Cycles | Pitch [x] | Pitch [x] | Termination | Mounting Type | Features | FFC, FCB Thickness | Connector/Contact Type | Housing Material | Operating Temperature [Max] | Operating Temperature [Min] | Cable End Type | Number of Positions |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex | FFC | UL94 V-0 | Black | 0.5 A | Copper Alloy | 50 V | 4.85 mm | 0.191 in | Gold | Slide Lock | 20 | 0.5 mm | 0.02 in | Solder | Surface Mount Right Angle | Board Guide Solder Retention | 0.3 mm | Contacts Bottom | Liquid Crystal Polymer (LCP) Glass Filled | 85 °C | -40 °C | Notched | 30 |
Molex | FFC | UL94 V-0 | Black | 0.5 A | Copper Alloy | 50 V | 4.85 mm | 0.191 in | Gold | Slide Lock | 20 | 0.5 mm | 0.02 in | Solder | Surface Mount Right Angle | Board Guide Solder Retention | 0.3 mm | Contacts Bottom | Liquid Crystal Polymer (LCP) Glass Filled | 85 °C | -40 °C | Notched | 50 |
Molex | FFC | UL94 V-0 | Black | Copper Alloy | 4.85 mm | 0.191 in | Tin Bismuth | Slide Lock | 0.5 mm | 0.02 in | Solder | Surface Mount Right Angle | Board Guide Solder Retention | 0.3 mm | Contacts Bottom | Liquid Crystal Polymer (LCP) Glass Filled | Notched | 50 | |||||
Molex | FFC | UL94 V-0 | Black | Copper Alloy | 4.85 mm | 0.191 in | Tin Bismuth | Slide Lock | 0.5 mm | 0.02 in | Solder | Surface Mount Right Angle | Board Guide Solder Retention | 0.3 mm | Contacts Bottom | Liquid Crystal Polymer (LCP) Glass Filled | Notched | 50 | |||||
Molex | FFC | UL94 V-0 | Black | 0.5 A | Copper Alloy | 50 V | 4.85 mm | 0.191 in | Gold | Slide Lock | 20 | 0.5 mm | 0.02 in | Solder | Surface Mount Right Angle | Board Guide Solder Retention | 0.3 mm | Contacts Bottom | Liquid Crystal Polymer (LCP) Glass Filled | 85 °C | -40 °C | Notched | 80 |