501745 Series
Manufacturer: Molex
SLIMSTACK BOARD-TO-BOARD PLUG, 0.40MM PITCH, J-BEND SERIES, 2.00 OR 2.30MM MATED HEIGHT, 3.40 OR 4.20MM MATED WIDTH, 12 CIRCUITS
| Part | Height Above Board [z] | Height Above Board [z] | Contact Finish | Mounting Type | Number of Rows [custom] | Contact Finish Thickness | Contact Finish Thickness | Mated Stacking Heights | Pitch | Pitch | Features | Connector Type | Number of Positions |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex | 1.64 mm | 0.064 " | Gold | Surface Mount | 2 | 0.203 çm | 8 µin | 2 mm | 0.4 mm | 0.016 in | Solder Retention | Plug Outer Shroud Contacts | 12 |
Molex | 1.64 mm | 0.064 " | Gold | Surface Mount | 2 | 0.203 çm | 8 µin | 2 mm 2.3 mm | 0.4 mm | 0.016 in | Solder Retention | Plug Outer Shroud Contacts | 60 |
Molex | 1.64 mm | 0.064 " | Gold | Surface Mount | 2 | 0.203 çm | 8 µin | 2 mm | 0.4 mm | 0.016 in | Solder Retention | Plug Outer Shroud Contacts | 50 |
Molex | 1.64 mm | 0.064 " | Gold | Surface Mount | 2 | 0.203 çm | 8 µin | 2 mm 2.3 mm | 0.4 mm | 0.016 in | Solder Retention | Plug Outer Shroud Contacts | 40 |
Molex | 1.64 mm | 0.064 " | Gold | Surface Mount | 2 | 0.203 çm | 8 µin | 2 mm | 0.4 mm | 0.016 in | Solder Retention | Plug Outer Shroud Contacts | 80 |
Molex | 1.64 mm | 0.064 " | Gold | Surface Mount | 2 | 0.203 çm | 8 µin | 2 mm 2.3 mm | 0.4 mm | 0.016 in | Solder Retention | Plug Outer Shroud Contacts | 30 |
Molex | 1.64 mm | 0.064 " | Gold | Surface Mount | 2 | 0.203 çm | 8 µin | 2 mm 2.3 mm | 0.4 mm | 0.016 in | Solder Retention | Plug Outer Shroud Contacts | 50 |