085727 Series
Manufacturer: Molex
8 SHIELDED GOLD COPPER ALLOY WITHLED 0℃~+70℃ PLUGIN ETHERNET CONNECTORS / MODULAR CONNECTORS (RJ45 RJ11) ROHS
| Part | Contact Material | Termination | Number of Rows | LED Color | Mounting Type | Number of Cores per Jack | Shield Material | Number of Ports | Shielding | Contact Finish Thickness | Contact Finish Thickness | Orientation | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish | Tab Direction | Connector Type | Housing Material | Applications | Height Above Board | Height Above Board | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex | Copper Alloy | Solder | 2 | Green Orange - Green | Through Hole | 8 | Brass | 8 | Shielded EMI Finger | 0.76 Ám | 30 Áin | 90 ° | 70 °C | 0 °C | Gold | Up and Down | RJ45 | Polybutylene Terephthalate (PBT) Glass Filled | 10/100/1000 Base-T AutoMDIX | 25.46 mm | 1.002 in | Board Guide |
Molex | Copper Alloy | Solder | 2 | Yellow Green | Through Hole | 8 | Brass | 8 | Shielded EMI Finger | 0.76 Ám | 30 Áin | 90 ° | 70 °C | 0 °C | Gold | Up and Down | RJ45 | Glass Filled Polybutylene Terephthalate (PBT) Polyester | 10/100/1000 Base-T AutoMDIX | 25.46 mm | 1.002 in | Board Guide |
Molex | Copper Alloy | Solder | 2 | Green - Green | Through Hole | 8 | Brass | 8 | Shielded EMI Finger | 0.76 Ám | 30 Áin | 90 ° | 70 °C | 0 °C | Gold | Up and Down | RJ45 | Glass Filled Polybutylene Terephthalate (PBT) Polyester | 10/100/1000 Base-T AutoMDIX | 25.46 mm | 1.002 in | Board Guide |
Molex | Copper Alloy | Solder | 2 | Green Yellow | Through Hole | 8 | Brass | 8 | Shielded EMI Finger | 0.76 Ám | 30 Áin | 90 ° | 70 °C | 0 °C | Gold | Up and Down | RJ45 | Glass Filled Polybutylene Terephthalate (PBT) Polyester | 10/100/1000 Base-T AutoMDIX | 25.46 mm | 1.002 in | Board Guide |