HMTMS-105 Series

Board to Board & Mezzanine Connectors .050" x .100" High-Temp Variable Post Height Micro Terminal Strip

Catalog

Board to Board & Mezzanine Connectors .050" x .100" High-Temp Variable Post Height Micro Terminal Strip

Part	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Mating	Pitch - Mating	Overall Contact Length	Overall Contact Length	Shrouding	Contact Finish - Post	Contact Material	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Length - Post	Contact Length - Post	Number of Positions Loaded	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Type	Insulation Material	Termination	Contact Shape	Insulation Height	Insulation Height	Insulation Color	Contact Finish - Mating	Mounting Type	Contact Length - Mating	Contact Length - Mating	Number of Rows	Number of Positions	Fastening Type	Connector Type	Contact Length - Post [x]	Contact Length - Post [x]	Contact Length - Mating [x]	Number of Positions Loaded
Samtec Inc. HMTMS-117-51-G-D-155	-55 °C	125 °C	0.05 in	1.27 mm	0.41 in	10.41 mm	Unshrouded	Gold	Phosphor Bronze	2.54 mm	0.1 in	3.94 mm	0.155 "	All	10 çin	0.25 çm	Flash	Male Pin	Liquid Crystal Polymer (LCP)	Solder	Square	0.1 in	2.54 mm	Black	Gold	Through Hole	3.94 mm	0.155 in	2	34	Push-Pull	Header
Samtec Inc. HMTMS-105-02-S-D-100	-55 °C	125 °C	0.05 in	1.27 mm			Unshrouded	Tin	Phosphor Bronze	2.54 mm	0.1 in			All	30 Áin	0.76 Ám		Male Pin	Liquid Crystal Polymer (LCP)	Solder	Square	0.1 in	2.54 mm	Black	Gold	Through Hole	2.54 mm	0.1 in	2	10	Push-Pull	Header	0.12 in	3.05 mm
Samtec Inc. HMTMS-105-55-S-D-370	-55 °C	125 °C	0.05 in	1.27 mm	0.61 in	15.5 mm	Unshrouded	Tin	Phosphor Bronze	2.54 mm	0.1 in			All	30 Áin	0.76 Ám		Male Pin	Liquid Crystal Polymer (LCP)	Solder	Square	0.1 in	2.54 mm	Black	Gold	Through Hole	9.4 mm	0.37 in	2	10	Push-Pull	Header	0.14 in	3.56 mm
Samtec Inc. HMTMS-105-01-G-S-215	-55 °C	125 °C	0.05 in	1.27 mm	0.45 "	11.43 mm	Unshrouded	Gold	Phosphor Bronze					All	10 çin	0.25 çm	Flash	Male Pin	Liquid Crystal Polymer (LCP)	Solder	Square	0.1 in	2.54 mm	Black	Gold	Through Hole	5.46 mm	0.215 in	1		Push-Pull	Header	0.135 in	3.43 mm
Samtec Inc. HMTMS-105-02-G-D-100	-55 °C	125 °C	0.05 in	1.27 mm			Unshrouded	Gold	Phosphor Bronze	2.54 mm	0.1 in			All	10 çin	0.25 çm	Flash	Male Pin	Liquid Crystal Polymer (LCP)	Solder	Square	0.1 in	2.54 mm	Black	Gold	Through Hole	2.54 mm	0.1 in	2	10	Push-Pull	Header	0.12 in	3.05 mm
Samtec Inc. HMTMS-105-25-S-D-125	-55 °C	125 °C	0.05 in	1.27 mm	0.33 in	8.38 mm	Unshrouded	Tin	Phosphor Bronze	2.54 mm	0.1 in	2.67 mm	0.105 in	All	30 Áin	0.76 Ám		Male Pin	Liquid Crystal Polymer (LCP)	Solder	Square	0.1 in	2.54 mm	Black	Gold	Through Hole	3.18 mm	0.125 in	2	10	Push-Pull	Header
Samtec Inc. HMTMS-117-01-G-S-230	-55 °C	125 °C	0.05 in	1.27 mm	0.45 "	11.43 mm	Unshrouded	Gold	Phosphor Bronze					All	10 çin	0.25 çm	Flash	Male Pin	Liquid Crystal Polymer (LCP)	Solder	Square	0.1 in	2.54 mm	Black	Gold	Through Hole	5.84 mm		1		Push-Pull	Header	0.12 in	3.05 mm	0.23 in
Samtec Inc. HMTMS-120-25-S-S-125	-55 °C	125 °C	0.05 in	1.27 mm	0.33 in	8.38 mm	Unshrouded	Tin	Phosphor Bronze			2.67 mm	0.105 in	All	30 Áin	0.76 Ám		Male Pin	Liquid Crystal Polymer (LCP)	Solder	Square	0.1 in	2.54 mm	Black	Gold	Through Hole	3.18 mm	0.125 in	1	20	Push-Pull	Header
Samtec Inc. HMTMS-105-25-SM-D-125-009	-55 °C	125 °C	0.05 in	1.27 mm	0.33 in	8.38 mm	Unshrouded	Tin	Phosphor Bronze	2.54 mm	0.1 in	2.67 mm	0.105 in		30 Áin	0.76 Ám		Male Pin	Liquid Crystal Polymer (LCP)	Solder	Square	0.1 in	2.54 mm	Black	Gold	Through Hole	3.18 mm	0.125 in	2	10	Push-Pull	Header				9
Samtec Inc. HMTMS-105-25-S-D-125-009	-55 °C	125 °C	0.05 in	1.27 mm	0.33 in	8.38 mm	Unshrouded	Tin	Phosphor Bronze	2.54 mm	0.1 in	2.67 mm	0.105 in		30 Áin	0.76 Ám		Male Pin	Liquid Crystal Polymer (LCP)	Solder	Square	0.1 in	2.54 mm	Black	Gold	Through Hole	3.18 mm	0.125 in	2	10	Push-Pull	Header				9