W25Q32 Series
Manufacturer: Winbond Electronics
IC FLASH 32MBIT SPI/QUAD 24TFBGA
| Part | Clock Frequency | Memory Type | Memory Interface | Package / Case | Supplier Device Package | Memory Size | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Memory Organization | Memory Format | Mounting Type | Voltage - Supply [Max] | Voltage - Supply [Min] | Operating Temperature [Min] | Operating Temperature [Max] | Technology | Write Cycle Time - Word, Page | Package / Case | Package / Case | Access Time | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 104 MHz | Non-Volatile | QPI SPI - Quad I/O | 24-TBGA | 24-TFBGA (8x6) | 4 MB | 50 µs | 3 ms | 4M x 8 | FLASH | Surface Mount | 3.6 V | 2.7 V | -40 °C | 105 °C | FLASH - NOR | |||||
Winbond Electronics | 133 MHz | Non-Volatile | DTR QPI SPI - Quad I/O | 16-SOIC | 16-SOIC | 4 MB | 4M x 8 | FLASH | Surface Mount | 3.6 V | 2.7 V | -40 ¯C | 85 C | FLASH - NOR | 3 ms | 7.5 mm | 0.295 " | 6 ns | |||
Winbond Electronics | 104 MHz | Non-Volatile | QPI SPI - Quad I/O | 24-TBGA | 24-TFBGA (8x6) | 4 MB | 50 µs | 3 ms | 4M x 8 | FLASH | Surface Mount | 3.6 V | 2.7 V | -40 °C | 105 °C | FLASH - NOR | |||||
Winbond Electronics | 104 MHz | Non-Volatile | QPI SPI - Quad I/O | 8-WDFN Exposed Pad | 8-WSON (8x6) | 4 MB | 50 µs | 3 ms | 4M x 8 | FLASH | Surface Mount | 3.6 V | 2.7 V | -40 ¯C | 85 C | FLASH - NOR | 7 ns | ||||
Winbond Electronics | 133 MHz | Non-Volatile | SPI - Quad I/O | 24-TBGA | 24-TFBGA (8x6) | 4 MB | 4M x 8 | FLASH | Surface Mount | 3.6 V | 2.7 V | -40 ¯C | 85 C | FLASH - NOR | 3 ms | ||||||
Winbond Electronics | 133 MHz | Non-Volatile | SPI - Quad I/O | 8-XDFN Exposed Pad | 8-XSON (4x4) | 4 MB | 4M x 8 | FLASH | Surface Mount | 3.6 V | 2.7 V | -40 ¯C | 85 C | FLASH - NOR | 3 ms | ||||||
Winbond Electronics | 104 MHz | Non-Volatile | QPI SPI - Quad I/O | 16-SOIC | 16-SOIC | 4 MB | 50 µs | 3 ms | 4M x 8 | FLASH | Surface Mount | 3.6 V | 2.7 V | -40 °C | 105 °C | FLASH - NOR | 7.5 mm | 0.295 " | |||
Winbond Electronics | 133 MHz | Non-Volatile | SPI - Quad I/O | 8-SOIC | 8-VSOP | 4 MB | 4M x 8 | FLASH | Surface Mount | 3.6 V | 2.7 V | -40 ¯C | 85 C | FLASH - NOR | 3 ms | 0.209 in 5.3 mm | |||||
Winbond Electronics | 104 MHz | Non-Volatile | SPI - Quad I/O | 24-TBGA | 24-TFBGA (8x6) | 4 MB | 50 µs | 3 ms | 4M x 8 | FLASH | Surface Mount | 3.6 V | 2.7 V | -40 °C | 105 °C | FLASH - NOR | |||||
Winbond Electronics | 104 MHz | Non-Volatile | QPI SPI - Quad I/O | 24-TBGA | 24-TFBGA (8x6) | 4 MB | 50 µs | 3 ms | 4M x 8 | FLASH | Surface Mount | 3.6 V | 2.7 V | -40 °C | 105 °C | FLASH - NOR |