ESQT-106 Series

Catalog

CONN ELEVATED SOCKET SKT 12 POS 2MM SOLDER ST TOP ENTRY THRU-HOLE LAYER

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Part	Insulation Color	Insulation Height	Insulation Height	Connector Type	Mounting Type	Contact Type	Current Rating (Amps)	Contact Shape	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Rows	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions	Style	Row Spacing - Mating	Row Spacing - Mating	Contact Material	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating [x]	Pitch - Mating [x]	Termination	Contact Length - Post	Contact Length - Post	Fastening Type	Number of Positions Loaded	Material Flammability Rating	Insulation Material	Contact Length - Post [x]	Contact Length - Post [x]	Insulation Height [z]	Insulation Height [z]
Samtec Inc. ESQT-106-02-G-D-720	Black	18.3 mm	0.72 in	Elevated Socket	Through Hole	Forked	4.5 A	Square	0.51 µm	20 µin	Gold	2	-55 °C	125 °C	12	Board to Board Cable	0.079 in	2 mm	Phosphor Bronze	Gold	3 µin	0.076 µm	0.079 in	2 mm	Solder	0.13 in	3.3 mm	Push-Pull	All	UL94 V-0	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-106-02-L-D-410	Black			Elevated Socket	Through Hole	Forked	4.5 A	Square	0.25 çm	10 çin	Tin	2	-55 °C	125 °C	12	Board to Board Cable	0.079 in	2 mm	Phosphor Bronze	Gold			0.079 in	2 mm	Solder	0.44 in	11.18 mm	Push-Pull	All	UL94 V-0	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-106-03-F-D-408	Black	10.36 mm	0.408 in	Elevated Socket	Through Hole	Forked	4.5 A	Square	0.076 µm	3 µin	Tin	2	-55 °C	125 °C	12	Board to Board Cable	0.079 in	2 mm	Phosphor Bronze	Gold			0.079 in	2 mm	Solder	0.05 in	1.27 mm	Push-Pull	All	UL94 V-0	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-106-02-G-S-523	Black	13.28 mm	0.523 "	Elevated Socket	Through Hole	Forked	4.5 A	Square	0.51 µm	20 µin	Gold	1	-55 °C	125 °C	6	Board to Board Cable			Phosphor Bronze	Gold	3 µin	0.076 µm	0.079 in	2 mm	Solder	0.327 "	8.3 mm	Push-Pull	All	UL94 V-0	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-106-02-L-S-590	Black	14.99 mm	0.59 in	Elevated Socket	Through Hole	Forked	4.5 A	Square	0.25 çm	10 çin	Tin	1	-55 °C	125 °C	6	Board to Board Cable			Phosphor Bronze	Gold			0.079 in	2 mm	Solder			Push-Pull	All	UL94 V-0	Liquid Crystal Polymer (LCP)	0.26 in	6.6 mm
Samtec Inc. ESQT-106-03-F-D-355	Black	9.02 mm	0.355 in	Elevated Socket	Through Hole	Forked	4.5 A	Square	0.076 µm	3 µin	Tin	2	-55 °C	125 °C	12	Board to Board Cable	0.079 in	2 mm	Phosphor Bronze	Gold			0.079 in	2 mm	Solder		2.62 mm	Push-Pull	All	UL94 V-0	Liquid Crystal Polymer (LCP)	0.103 in
Samtec Inc. ESQT-106-02-F-D-600	Black	15.24 mm	0.6 in	Elevated Socket	Through Hole	Forked	4.5 A	Square	0.076 µm	3 µin	Tin	2	-55 °C	125 °C	12	Board to Board Cable	0.079 in	2 mm	Phosphor Bronze	Gold			0.079 in	2 mm	Solder	0.25 in	6.35 mm	Push-Pull	All	UL94 V-0	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-106-02-F-S-309	Black	7.85 mm	0.309 in	Elevated Socket	Through Hole	Forked	4.5 A	Square	0.076 µm	3 µin	Tin	1	-55 °C	125 °C	6	Board to Board Cable			Phosphor Bronze	Gold			0.079 in	2 mm	Solder	0.541 in	13.74 mm	Push-Pull	All	UL94 V-0	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-106-03-M-D-314	Black			Elevated Socket	Through Hole	Forked	4.5 A	Square	0.51 µm	20 µin	Tin	2	-55 °C	125 °C	12	Board to Board Cable	0.079 in	2 mm	Phosphor Bronze	Gold			0.079 in	2 mm	Solder	0.144 in	3.66 mm	Push-Pull	All	UL94 V-0	Liquid Crystal Polymer (LCP)			0.314 "	7.98 mm
Samtec Inc. ESQT-106-03-M-D-374	Black	9.5 mm	0.374 in	Elevated Socket	Through Hole	Forked	4.5 A	Square	0.51 µm	20 µin	Tin	2	-55 °C	125 °C	12	Board to Board Cable	0.079 in	2 mm	Phosphor Bronze	Gold			0.079 in	2 mm	Solder	0.084 in	2.13 mm	Push-Pull	All	UL94 V-0	Liquid Crystal Polymer (LCP)