
Catalog
Functional isolation dual-channel 1/1 digital isolator
Key Features
• Dual channel, CMOS output functional isolators50Mbps data rateRobust SiO2 isolation barrier with ±150kV/µs typical CMTIFunctional Isolation (8-REU):200VRMS, 280VDC working voltage570VRMS, 800VDC transient voltage (60s)Functional Isolation (8-D):450VRMS, 637VDC working voltage707VRMS, 1000VDC transient voltage (60s)Available in a compact 8-REU package with >2.2mm creepageWide supply range: 1.71V to 1.89V and 2.25V to 5.5V1.71V to 5.5V level translationDefault output High (ISO652x) and Low (ISO652xF) OptionsWide temperature range: –40°C to 125°C1.8mA per channel typical at 1Mbps at 3.3VLow propagation delay: 11ns typical at 3.3VRobust electromagnetic compatibility (EMC)System-Level ESD, EFT, and surge immunityUltra-low emissionsLeadless-DFN (8-REU) package and Narrow-SOIC (8-D) package optionsDual channel, CMOS output functional isolators50Mbps data rateRobust SiO2 isolation barrier with ±150kV/µs typical CMTIFunctional Isolation (8-REU):200VRMS, 280VDC working voltage570VRMS, 800VDC transient voltage (60s)Functional Isolation (8-D):450VRMS, 637VDC working voltage707VRMS, 1000VDC transient voltage (60s)Available in a compact 8-REU package with >2.2mm creepageWide supply range: 1.71V to 1.89V and 2.25V to 5.5V1.71V to 5.5V level translationDefault output High (ISO652x) and Low (ISO652xF) OptionsWide temperature range: –40°C to 125°C1.8mA per channel typical at 1Mbps at 3.3VLow propagation delay: 11ns typical at 3.3VRobust electromagnetic compatibility (EMC)System-Level ESD, EFT, and surge immunityUltra-low emissionsLeadless-DFN (8-REU) package and Narrow-SOIC (8-D) package options
Description
AI
The ISO652x devices are high-performance, dual-channel functional isolators designed for cost sensitive, space constrained applications that require isolation for non-safety applications. The isolation barrier supports a working voltage of 200VRMS / 280VDC and transient over voltages of 570VRMS / 800VDC.
The devices provide high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by TI’s double capacitive silicon dioxide (SiO2) insulation barrier. ISO6520 has two isolation channels with both channels in the same direction. ISO6521 has two isolation channels with one channel in each direction. In the event of input power or signal loss, the default output is high for devices without suffix F and low for devices with suffix F. See Device Functional Modes section for further details.
These devices help prevent noise currents on data buses, such as UART, SPI, RS-485, RS-232, and CAN from damaging sensitive circuitry. Through chip design and layout techniques, the electromagnetic compatibility of the devices have been significantly enhanced to ease system-level ESD and emissions compliance.
The ISO652x devices are high-performance, dual-channel functional isolators designed for cost sensitive, space constrained applications that require isolation for non-safety applications. The isolation barrier supports a working voltage of 200VRMS / 280VDC and transient over voltages of 570VRMS / 800VDC.
The devices provide high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by TI’s double capacitive silicon dioxide (SiO2) insulation barrier. ISO6520 has two isolation channels with both channels in the same direction. ISO6521 has two isolation channels with one channel in each direction. In the event of input power or signal loss, the default output is high for devices without suffix F and low for devices with suffix F. See Device Functional Modes section for further details.
These devices help prevent noise currents on data buses, such as UART, SPI, RS-485, RS-232, and CAN from damaging sensitive circuitry. Through chip design and layout techniques, the electromagnetic compatibility of the devices have been significantly enhanced to ease system-level ESD and emissions compliance.