BDN13 Series
Manufacturer: CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.31"SQ
| Part | Shelf Life | Type | Package Cooled | Fin Height [custom] | Fin Height | Material Finish | Thermal Resistance @ Forced Air Flow | Width [x] | Width [x] | Shape | Thermal Resistance @ Natural | Attachment Method | Material | Length | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CTS Thermal Management Products | 24 Months | Top Mount | ASIC BGA CPU LGA | 0.355 in | 9.02 mm | Black Anodized | 6 °C/W | 1.31 in | 33.27 mm | Pin Fins Square | 16.1 °C/W | Thermal Tape Adhesive (Included) | Aluminum | 33.27 mm | 1.31 in |