SMD291 Series
Manufacturer: Chip Quik Inc.
Catalog
SOLDER PASTE IN JAR 50G (T6) SAC
| Part | Mesh Type | Composition | Flux Type | Type | Shelf Life | Form | Form | Form | Shelf Life Start | Melting Point [Max] [custom] | Melting Point [Min] [custom] | Melting Point [Max] [custom] | Melting Point [Min] [custom] | Form |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | 6 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | No-Clean | Solder Paste | 6 Months | Jar | 1.76 oz | 50 g | Date of Manufacture | 428 °F | 217 °C | 220 °C | 422 °F | |
 Chip Quik Inc. | 6 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | No-Clean | Solder Paste | 6 Months | Syringe | 15 g | Date of Manufacture | 428 °F | 217 °C | 220 °C | 422 °F | 0.53 oz 5 ml |