SMD291 Series
Manufacturer: Chip Quik Inc.
Beta
⌘K
SOLDER PASTE IN JAR 50G (T6) SAC
| Part | Mesh Type | Type | Melting Point [Max] | Melting Point [Max] | Melting Point [Min] | Melting Point [Min] | Shelf Life | Composition | Form | Form | Form | Flux Type | Shelf Life Start |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | 6 | Solder Paste | 220 °C | 428 °F | 422 °F | 217 °C | 6 Months | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 1.76 oz | 50 g | Jar | No-Clean | Date of Manufacture |
 Chip Quik Inc. | 6 | Solder Paste | 220 °C | 428 °F | 422 °F | 217 °C | 6 Months | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.53 oz 5 ml 15 g | Syringe | No-Clean | Date of Manufacture |