LDBAA Series

Manufacturer: KEMET

Catalog

CAP FILM 0.039UF 5% 16VDC 1206

Part	Capacitance	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Tolerance	Dielectric Material	Package / Case	Applications	Voltage Rating - DC	Height - Seated (Max) [Max] [z]	Height - Seated (Max) [Max] [z]	Size / Dimension [y]	Size / Dimension [x]	Size / Dimension [x]	Size / Dimension [y]	Height - Seated (Max) [Max]	Height - Seated (Max) [Max]
KEMET LDBAA2390JC5N0	0.039 µF	Surface Mount	-55 C	125 °C	Solder Pads	5 %	Polyphenylene Sulfide (PPS) Metallized - Stacked	1206 (3216 Metric)	General Purpose	16 V	1.2 mm	0.047 "	0.067 in	0.13 "	3.3 mm	1.7 mm
KEMET LDBAA2330GC5N0	0.033 çF	Surface Mount	-55 C	125 °C	Solder Pads	2 %	Polyphenylene Sulfide (PPS) Metallized - Stacked	1206 (3216 Metric)	General Purpose	16 V			0.067 in	0.13 "	3.3 mm	1.7 mm	0.043 "	1.1 mm
KEMET LDBAA2220JC5N0	0.022 µF	Surface Mount	-55 C	125 °C	Solder Pads	5 %	Polyphenylene Sulfide (PPS) Metallized - Stacked	1206 (3216 Metric)	General Purpose	16 V			0.067 in	0.13 "	3.3 mm	1.7 mm	0.043 "	1.1 mm
KEMET LDBAA2270JC5N0	0.027 µF	Surface Mount	-55 C	125 °C	Solder Pads	5 %	Polyphenylene Sulfide (PPS) Metallized - Stacked	1206 (3216 Metric)	General Purpose	16 V			0.067 in	0.13 "	3.3 mm	1.7 mm	0.043 "	1.1 mm
KEMET LDBAA2220GC5N0	0.022 µF	Surface Mount	-55 C	125 °C	Solder Pads	2 %	Polyphenylene Sulfide (PPS) Metallized - Stacked	1206 (3216 Metric)	General Purpose	16 V			0.067 in	0.13 "	3.3 mm	1.7 mm	0.043 "	1.1 mm
KEMET LDBAA2270GC5N0	0.027 µF	Surface Mount	-55 C	125 °C	Solder Pads	2 %	Polyphenylene Sulfide (PPS) Metallized - Stacked	1206 (3216 Metric)	General Purpose	16 V			0.067 in	0.13 "	3.3 mm	1.7 mm	0.043 "	1.1 mm
KEMET LDBAA2120JC5N0	0.012 µF	Surface Mount	-55 C	125 °C	Solder Pads	5 %	Polyphenylene Sulfide (PPS) Metallized - Stacked	1206 (3216 Metric)	General Purpose	16 V			0.067 in	0.13 "	3.3 mm	1.7 mm	0.043 "	1.1 mm