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ESQT-125 Series

Manufacturer: Samtec Inc.

Catalog

CONN SOCKET 50POS 0.079 GOLD PCB

...
PartContact MaterialContact Length - Post [x]Contact Length - Post [x]Contact Finish - PostStylePitch - Mating [x]Pitch - Mating [x]Contact Finish Thickness - PostContact Finish Thickness - PostTerminationInsulation MaterialCurrent Rating (Amps)Row Spacing - MatingRow Spacing - MatingNumber of RowsFastening TypeNumber of PositionsNumber of Positions LoadedContact Finish Thickness - MatingContact Finish Thickness - MatingInsulation ColorInsulation HeightInsulation HeightOperating Temperature [Min]Operating Temperature [Max]Mounting TypeContact ShapeConnector TypeContact TypeMaterial Flammability RatingContact Finish - MatingContact Length - PostContact Length - Post
Phosphor Bronze
3.18 mm
0.125 in
Gold
Board to Board
Cable
0.079 in
2 mm
3 µin
0.076 µm
Solder
Liquid Crystal Polymer (LCP)
4.5 A
0.079 in
2 mm
2
Push-Pull
50
All
0.51 µm
20 µin
Black
0.725 "
18.42 mm
-55 °C
125 °C
Through Hole
Square
Elevated Socket
Forked
UL94 V-0
Gold
Phosphor Bronze
0.24 in
Tin
Board to Board
Cable
0.079 in
2 mm
Solder
Liquid Crystal Polymer (LCP)
4.5 A
0.079 in
2 mm
2
Push-Pull
50
All
0.51 µm
20 µin
Black
0.61 in
15.49 mm
-55 °C
125 °C
Through Hole
Square
Elevated Socket
Forked
UL94 V-0
Gold
6.1 mm
Phosphor Bronze
Tin
Board to Board
Cable
0.079 in
2 mm
Solder
Liquid Crystal Polymer (LCP)
4.5 A
0.079 in
2 mm
Push-Pull
100
All
0.51 µm
20 µin
Black
0.368 in
9.35 mm
-55 °C
125 °C
Through Hole
Square
Elevated Socket
Forked
UL94 V-0
Gold
2.29 mm
0.09 "
Phosphor Bronze
Tin
Board to Board
Cable
0.079 in
2 mm
Solder
Liquid Crystal Polymer (LCP)
4.5 A
0.079 in
2 mm
2
Push-Pull
50
All
0.25 çm
10 çin
Black
0.525 in
13.34 mm
-55 °C
125 °C
Through Hole
Square
Elevated Socket
Forked
UL94 V-0
Gold
8.25 mm
0.325 in
Phosphor Bronze
Gold
Board to Board
Cable
0.079 in
2 mm
3 µin
0.076 µm
Solder
Liquid Crystal Polymer (LCP)
4.5 A
0.079 in
2 mm
Push-Pull
100
All
0.51 µm
20 µin
Black
0.31 in
7.87 mm
-55 °C
125 °C
Through Hole
Square
Elevated Socket
Forked
UL94 V-0
Gold
13.72 mm
0.54 in
Phosphor Bronze
Tin
Board to Board
Cable
0.079 in
2 mm
Solder
Liquid Crystal Polymer (LCP)
4.5 A
0.079 in
2 mm
2
Push-Pull
50
All
0.76 Ám
30 Áin
Black
0.597 in
15.16 mm
-55 °C
125 °C
Through Hole
Square
Elevated Socket
Forked
UL94 V-0
Gold
6.43 mm
0.253 in
Phosphor Bronze
3.63 mm
0.143 in
Tin
Board to Board
Cable
0.079 in
2 mm
Solder
Liquid Crystal Polymer (LCP)
4.5 A
0.079 in
2 mm
2
Push-Pull
50
All
0.51 µm
20 µin
Black
0.315 in
8 mm
-55 °C
125 °C
Through Hole
Square
Elevated Socket
Forked
UL94 V-0
Gold
Phosphor Bronze
Tin
Board to Board
Cable
0.079 in
2 mm
Solder
Liquid Crystal Polymer (LCP)
4.5 A
0.079 in
2 mm
2
Push-Pull
50
All
0.51 µm
20 µin
Black
0.76 in
19.3 mm
-55 °C
125 °C
Through Hole
Square
Elevated Socket
Forked
UL94 V-0
Gold
2.29 mm
0.09 "
Phosphor Bronze
Gold
Board to Board
Cable
0.079 in
2 mm
3 µin
0.076 µm
Solder
Liquid Crystal Polymer (LCP)
4.5 A
0.079 in
2 mm
2
Push-Pull
50
All
0.51 µm
20 µin
Black
-55 °C
125 °C
Through Hole
Square
Elevated Socket
Forked
UL94 V-0
Gold
8.18 mm
0.322 in
Phosphor Bronze
Gold
Board to Board
Cable
0.079 in
2 mm
3 µin
0.076 µm
Solder
Liquid Crystal Polymer (LCP)
4.5 A
0.079 in
2 mm
2
Push-Pull
50
All
0.51 µm
20 µin
Black
0.676 in
17.17 mm
-55 °C
125 °C
Through Hole
Square
Elevated Socket
Forked
UL94 V-0
Gold
4.42 mm
0.174 in