SN74LVC3G06 Series

3-ch, 1.65-V to 5.5-V inverters with open-drain outputs

Catalog

3-ch, 1.65-V to 5.5-V inverters with open-drain outputs

Part	Package / Case [y]	Package / Case	Package / Case [y]	Current - Output High, Low [custom]	Current - Output High, Low [custom]	Input Logic Level - High [Min]	Input Logic Level - High [Max]	Current - Quiescent (Max) [Max]	Logic Type	Features	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Max Propagation Delay @ V, Max CL	Input Logic Level - Low [Max]	Input Logic Level - Low [Min]	Number of Circuits	Number of Inputs	Voltage - Supply [Max]	Voltage - Supply [Min]	Supplier Device Package	Supplier Device Package [y]	Supplier Device Package [x]
Texas Instruments SN74LVC3G06DCUR	2.3 mm	8-VFSOP	0.091 in	-	32 mA	1.7 V	2 V	10 µA	Inverter	Open Drain	85 °C	-40 °C	Surface Mount	2.9 ns	0.8 V	0.7 V	3	3	5.5 V	1.65 V
Texas Instruments SN74LVC3G06DCTR				-	32 mA	1.7 V	2 V	10 µA	Inverter	Open Drain	85 °C	-40 °C	Surface Mount	2.9 ns	0.8 V	0.7 V	3	3	5.5 V	1.65 V	SM8
Texas Instruments SN74LVC3G06DCUT	2.3 mm	8-VFSOP	0.091 in	-	32 mA	1.7 V	2 V	10 µA	Inverter	Open Drain	85 °C	-40 °C	Surface Mount	2.9 ns	0.8 V	0.7 V	3	3	5.5 V	1.65 V
Texas Instruments SN74LVC3G06YEAR		8-XFBGA DSBGA		-	32 mA	1.7 V	2 V	10 µA	Inverter	Open Drain	85 °C	-40 °C	Surface Mount	2.9 ns	0.8 V	0.7 V	3	3	5.5 V	1.65 V	8-XFBGA DSBGA
Texas Instruments SN74LVC3G06YEPR		8-XFBGA DSBGA		-	32 mA	1.7 V	2 V	10 µA	Inverter	Open Drain	85 °C	-40 °C	Surface Mount	2.9 ns	0.8 V	0.7 V	3	3	5.5 V	1.65 V	8-DSBGA (1.9x0.9)	0.9	1.9
Texas Instruments SN74LVC3G06DCUTG4	2.3 mm	8-VFSOP	0.091 in	-	32 mA	1.7 V	2 V	10 µA	Inverter	Open Drain	85 °C	-40 °C	Surface Mount	2.9 ns	0.8 V	0.7 V	3	3	5.5 V	1.65 V
Texas Instruments SN74LVC3G06DCTRG4				-	32 mA	1.7 V	2 V	10 µA	Inverter	Open Drain	85 °C	-40 °C	Surface Mount	2.9 ns	0.8 V	0.7 V	3	3	5.5 V	1.65 V	SM8

Catalog

3-ch, 1.65-V to 5.5-V inverters with open-drain outputs

Key Features

• Available in the Texas Instruments NanoFree PackageSupports 5-V VCCOperationInput and Open-Drain Output Accepts Voltages up to 5.5 VMax tpdof 3.4 ns at 3.3 VLow Power Consumption, 10-μA Max ICC±24-mA Output Drive at 3.3 VTypical VOLP(Output Ground Bounce) < 0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot) > 2 V at VCC= 3.3 V, TA= 25°CIoffSupports Live Insertion, Partial-Power-Down Mode and Back Drive ProtectionLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)Available in the Texas Instruments NanoFree PackageSupports 5-V VCCOperationInput and Open-Drain Output Accepts Voltages up to 5.5 VMax tpdof 3.4 ns at 3.3 VLow Power Consumption, 10-μA Max ICC±24-mA Output Drive at 3.3 VTypical VOLP(Output Ground Bounce) < 0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot) > 2 V at VCC= 3.3 V, TA= 25°CIoffSupports Live Insertion, Partial-Power-Down Mode and Back Drive ProtectionLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)

Description

This triple inverter buffer/driver is designed for 1.65-V to 5.5-V VCCoperation. The output of the SN74LVC3G06 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. This triple inverter buffer/driver is designed for 1.65-V to 5.5-V VCCoperation. The output of the SN74LVC3G06 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.