W25X16 Series
Manufacturer: Winbond Electronics
IC FLASH 16MBIT SPI 75MHZ 8SOIC
| Part | Write Cycle Time - Word, Page | Memory Size | Memory Interface | Memory Format | Supplier Device Package | Technology | Voltage - Supply [Min] | Voltage - Supply [Max] | Memory Organization | Mounting Type | Memory Type | Operating Temperature [Max] | Operating Temperature [Min] | Clock Frequency | Package / Case [y] | Package / Case | Package / Case [x] | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() Winbond Electronics | 3 ms | 16 Mb | SPI | FLASH | 8-SOIC | FLASH | 2.7 V | 3.6 V | 2 M | Surface Mount | Non-Volatile | 85 °C | -40 °C | 75 MHz | 5.3 mm | 8-SOIC | 0.209 " | ||
![]() Winbond Electronics | 3 ms | 16 Mb | SPI | FLASH | 8-WSON (6x5) | FLASH | 2.7 V | 3.6 V | 2 M | Surface Mount | Non-Volatile | 85 °C | -40 °C | 75 MHz | 8-WDFN Exposed Pad | ||||
![]() Winbond Electronics | 3 ms | 16 Mb | SPI | FLASH | 8-WSON (6x5) | FLASH | 2.7 V | 3.6 V | 2 M | Surface Mount | Non-Volatile | 85 °C | -40 °C | 75 MHz | 8-WDFN Exposed Pad | ||||
![]() Winbond Electronics | 3 ms | 16 Mb | SPI | FLASH | 8-SOIC | FLASH | 2.7 V | 3.6 V | 2 M | Surface Mount | Non-Volatile | 85 °C | -40 °C | 75 MHz | 5.3 mm | 8-SOIC | 0.209 " | ||
![]() Winbond Electronics | 3 ms | 16 Mb | SPI | FLASH | 8-PDIP | FLASH | 2.7 V | 3.6 V | 2 M | Through Hole | Non-Volatile | 85 °C | -40 °C | 75 MHz | 8-DIP | 0.3 in | 7.62 mm |