SN74AUP1T58 Series

Single-Supply Voltage Translator

Catalog

Single-Supply Voltage Translator

Part	Channel Type	Translator Type	Output Type	Voltage - VCCA [Max] [custom]	Voltage - VCCA [Min] [custom]	Mounting Type	Voltage - VCCB [Max]	Voltage - VCCB [Min]	Operating Temperature [Max]	Operating Temperature [Min]	Number of Circuits	Package / Case	Channels per Circuit	Supplier Device Package	Features
Texas Instruments SN74AUP1T58DRYR	Unidirectional	Voltage Level	Single-Ended	2.7 V	1.8 V	Surface Mount	3.6 V	2.3 V	85 °C	-40 °C	1	6-UFDFN	1	6-SON (1.45x1)	Configurable Gate Logic Functions
Texas Instruments SN74AUP1T58DBVR	Unidirectional	Voltage Level	Single-Ended	2.7 V	1.8 V	Surface Mount	3.6 V	2.3 V	85 °C	-40 °C	1	SOT-23-6	1	SOT-23-6	Configurable Gate Logic Functions
Texas Instruments SN74AUP1T58DCKT	Unidirectional	Voltage Level	Single-Ended	2.7 V	1.8 V	Surface Mount	3.6 V	2.3 V	85 °C	-40 °C	1	6-TSSOP SC-88 SOT-363	1	SC-70-6	Configurable Gate Logic Functions
Texas Instruments SN74AUP1T58DCKR	Unidirectional	Voltage Level	Single-Ended	2.7 V	1.8 V	Surface Mount	3.6 V	2.3 V	85 °C	-40 °C	1	6-TSSOP SC-88 SOT-363	1	SC-70-6	Configurable Gate Logic Functions
Texas Instruments SN74AUP1T58YFPR	Unidirectional	Voltage Level	Single-Ended	2.7 V	1.8 V	Surface Mount	3.6 V	2.3 V	85 °C	-40 °C	1	6-XFBGA DSBGA	1	6-DSBGA	Configurable Gate Logic Functions
Texas Instruments SN74AUP1T58DSFR	Unidirectional	Voltage Level	Single-Ended	2.7 V	1.8 V	Surface Mount	3.6 V	2.3 V	85 °C	-40 °C	1	6-XFDFN	1	6-SON (1x1)	Configurable Gate Logic Functions

Catalog

Single-Supply Voltage Translator

Key Features

• Available in the Texas Instruments NanoStar™ PackagesSingle-Supply Voltage Translator1.8 V to 3.3 V (at VCC= 3.3 V)2.5 V to 3.3 V (at VCC= 3.3 V)1.8 V to 2.5 V (at VCC= 2.5 V)3.3 V to 2.5 V (at VCC= 2.5 VNine Configurable Gate Logic FunctionsSchmitt-Trigger Inputs Reject Input Noise and Provide BetterOutput Signal IntegrityIoffSupports Partial-Power-Down Mode With LowLeakage Current (0.5 µA)Very Low Static and Dynamic Power ConsumptionPb-Free Packages Available: SON (DRY or DSF), SOT-23 (DBV),SC-70 (DCK), and NanoStar WCSPLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Performance Tested Per JESD 222000-V Human-Body Model(A114-B, Class II)1000-V Charged-Device Model (C101)Related Devices: SN74AUP1T57, SN74AUP1T97, and SN74AUP1T98NanoStar is a trademark of Texas Instruments.Available in the Texas Instruments NanoStar™ PackagesSingle-Supply Voltage Translator1.8 V to 3.3 V (at VCC= 3.3 V)2.5 V to 3.3 V (at VCC= 3.3 V)1.8 V to 2.5 V (at VCC= 2.5 V)3.3 V to 2.5 V (at VCC= 2.5 VNine Configurable Gate Logic FunctionsSchmitt-Trigger Inputs Reject Input Noise and Provide BetterOutput Signal IntegrityIoffSupports Partial-Power-Down Mode With LowLeakage Current (0.5 µA)Very Low Static and Dynamic Power ConsumptionPb-Free Packages Available: SON (DRY or DSF), SOT-23 (DBV),SC-70 (DCK), and NanoStar WCSPLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Performance Tested Per JESD 222000-V Human-Body Model(A114-B, Class II)1000-V Charged-Device Model (C101)Related Devices: SN74AUP1T57, SN74AUP1T97, and SN74AUP1T98NanoStar is a trademark of Texas Instruments.

Description

AUP technology is the industry’s lowest-power logic technology designed for use in battery-operated or battery backed-up equipment. The SN74AUP1T58 is designed for logic-level translation applications with input switching levels that accept 1.8-V LVCMOS signals, while operating from either a single 3.3-V or 2.5-V VCCsupply. The wide VCCrange of 2.3 V to 3.6 V allows the possibility of battery voltage drop during system operation and ensures normal operation between this range. Schmitt-trigger inputs (VT= 210 mV between positive and negative input transitions) offer improved noise immunity during switching transitions, which is especially useful on analog mixed-mode designs. Schmitt-trigger inputs reject input noise, ensure integrity of output signals, and allow for slow input signal transition. The SN74AUP1T58 can be easily configured to perform a required gate function by connecting A, B, and C inputs to VCCor ground (see Function Selection table). Up to nine commonly used logic gate functions can be performed. Ioffis a feature that allows for powered-down conditions (VCC= 0 V) and is important in portable and mobile applications. When VCC= 0 V, signals in the range from 0 V to 3.6 V can be applied to the inputs and outputs of the device. No damage occurs to the device under these conditions. The SN74AUP1T58 is designed with optimized current-drive capability of 4 mA to reduce line reflections, overshoot, and undershoot caused by high-drive outputs. NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package. AUP technology is the industry’s lowest-power logic technology designed for use in battery-operated or battery backed-up equipment. The SN74AUP1T58 is designed for logic-level translation applications with input switching levels that accept 1.8-V LVCMOS signals, while operating from either a single 3.3-V or 2.5-V VCCsupply. The wide VCCrange of 2.3 V to 3.6 V allows the possibility of battery voltage drop during system operation and ensures normal operation between this range. Schmitt-trigger inputs (VT= 210 mV between positive and negative input transitions) offer improved noise immunity during switching transitions, which is especially useful on analog mixed-mode designs. Schmitt-trigger inputs reject input noise, ensure integrity of output signals, and allow for slow input signal transition. The SN74AUP1T58 can be easily configured to perform a required gate function by connecting A, B, and C inputs to VCCor ground (see Function Selection table). Up to nine commonly used logic gate functions can be performed. Ioffis a feature that allows for powered-down conditions (VCC= 0 V) and is important in portable and mobile applications. When VCC= 0 V, signals in the range from 0 V to 3.6 V can be applied to the inputs and outputs of the device. No damage occurs to the device under these conditions. The SN74AUP1T58 is designed with optimized current-drive capability of 4 mA to reduce line reflections, overshoot, and undershoot caused by high-drive outputs. NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package.