W66BL6 Series
Manufacturer: Winbond Electronics
IC DRAM 2GBIT LVSTL 11 200WFBGA
| Part | Memory Organization | Memory Type | Access Time | Memory Format | Write Cycle Time - Word, Page | Clock Frequency | Supplier Device Package | Operating Temperature [Min] | Operating Temperature [Max] | Voltage - Supply [Min] | Voltage - Supply [Max] | Mounting Type | Technology | Memory Size | Package / Case | Memory Interface |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 128M x 16 | Volatile | 3.5 ns | DRAM | 18 ns | 2.133 GHz | 200-WFBGA (10x14.5) | -40 °C | 105 °C | 1.06 V 1.7 V | 1.17 V 1.95 V | Surface Mount | SDRAM - Mobile LPDDR4 | 2 Gbit | 200-WFBGA | LVSTL_11 |
Winbond Electronics | 128M x 16 | Volatile | 3.5 ns | DRAM | 18 ns | 1600 MHz | 200-WFBGA (10x14.5) | -40 °C | 105 °C | 1.06 V 1.7 V | 1.17 V 1.95 V | Surface Mount | SDRAM - Mobile LPDDR4 | 2 Gbit | 200-WFBGA | LVSTL_11 |
Winbond Electronics | 128M x 16 | Volatile | 3.5 ns | DRAM | 18 ns | 2.133 GHz | 200-WFBGA (10x14.5) | -40 °C | 105 °C | 1.06 V 1.7 V | 1.17 V 1.95 V | Surface Mount | SDRAM - Mobile LPDDR4 | 2 Gbit | 200-WFBGA | LVSTL_11 |
Winbond Electronics | 128M x 16 | Volatile | 3.5 ns | DRAM | 18 ns | 1866 MHz | 200-WFBGA (10x14.5) | -40 °C | 105 °C | 1.06 V 1.7 V | 1.17 V 1.95 V | Surface Mount | SDRAM - Mobile LPDDR4 | 2 Gbit | 200-WFBGA | LVSTL_11 |