8100 Series
Manufacturer: TWIN INDUSTRIES
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⌘K
BREADBOARD GENERAL PURPOSE
| Part | Pitch | Size / Dimension Length | Size / Dimension Width | Circuit Pattern | Board Thickness | Proto Board Type | Hole Diameter | Package Accepted |
|---|---|---|---|---|---|---|---|---|
 TWIN INDUSTRIES | 0.1 in | 5 in | 4 in | Pad Per Hole (Round) | 0.062 in | Breadboard General Purpose | 0.037 in | |
 TWIN INDUSTRIES | 0.02 in | 6 in | 4 in | 0.062 in | SMD to Plated Through Hole Board | TSSOP | ||
 TWIN INDUSTRIES | 7.9 in | 3.1 in | 0.062 in | DIP SMD | PSOP SSOP TSOP | |||
 TWIN INDUSTRIES | 0.02 in | 6 in | 4 in | 0.062 in | SMD to Plated Through Hole Board | SOIC | ||
 TWIN INDUSTRIES | 4.2 in | 4.2 in | 0.062 in | SMD to Plated Through Hole Board | SOIC | |||
 TWIN INDUSTRIES | 6 in | 4 in | 0.062 in | SMD to Plated Through Hole Board | QFP | |||
 TWIN INDUSTRIES | 4.2 in | 4.2 in | 0.062 in | SMD to Plated Through Hole Board | SOIC | |||
 TWIN INDUSTRIES | 6 in | 4 in | SMD to Plated Through Hole Board | SOIC | ||||
 TWIN INDUSTRIES | 6 in | 4 in | SMD to Plated Through Hole Board | TSSOP | ||||
 TWIN INDUSTRIES | 0.1 in | 6.5 in | 114.3 mm | Pad Per Hole (Round) | 0.062 in | Breadboard General Purpose | 0.037 in |