8100 Series
Manufacturer: TWIN INDUSTRIES
Beta
⌘K
BREADBOARD GENERAL PURPOSE
| Part | Pitch | Pitch | Size / Dimension [x] | Size / Dimension [y] | Size / Dimension [x] | Size / Dimension [y] | Circuit Pattern | Board Thickness | Board Thickness | Board Thickness | Proto Board Type | Hole Diameter [diameter] | Hole Diameter [diameter] | Package Accepted |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 TWIN INDUSTRIES | 0.1 " | 2.54 mm | 127 mm | 4 " | 5 " | 101.6 mm | Pad Per Hole (Round) | 1.57 mm | 0.062 " | 0.0625 in | Breadboard General Purpose | 0.037 in | 0.94 mm | |
 TWIN INDUSTRIES | 0.02 " | 0.5 mm | 152.4 mm | 4 " | 6 " | 101.6 mm | 1.57 mm | 0.062 " | 0.0625 in | SMD to Plated Through Hole Board | TSSOP | |||
 TWIN INDUSTRIES | 200.66 mm | 3.1 in | 7.9 in | 78.74 mm | 1.57 mm | 0.062 " | 0.0625 in | SMD to DIP | PSOP SSOP TSOP | |||||
 TWIN INDUSTRIES | 0.02 " | 0.5 mm | 152.4 mm | 4 " | 6 " | 101.6 mm | 1.57 mm | 0.062 " | 0.0625 in | SMD to Plated Through Hole Board | SOIC | |||
 TWIN INDUSTRIES | 4.2 " 106.68 mm | 4.2 " 106.68 mm | 1.57 mm | 0.062 " | 0.0625 in | SMD to Plated Through Hole Board | SOIC | |||||||
 TWIN INDUSTRIES | 152.4 mm | 4 " | 6 " | 101.6 mm | 1.57 mm | 0.062 " | 0.0625 in | SMD to Plated Through Hole Board | QFP | |||||
 TWIN INDUSTRIES | 4.2 " 106.68 mm | 4.2 " 106.68 mm | 1.57 mm | 0.062 " | 0.0625 in | SMD to Plated Through Hole Board | SOIC | |||||||
 TWIN INDUSTRIES | 152.4 mm | 4 " | 6 " | 101.6 mm | SMD to Plated Through Hole Board | SOIC | ||||||||
 TWIN INDUSTRIES | 152.4 mm | 4 " | 6 " | 101.6 mm | SMD to Plated Through Hole Board | TSSOP | ||||||||
 TWIN INDUSTRIES | 0.1 " | 2.54 mm | 165.1 mm | 4.5 " | 6.5 in | 114.3 mm | Pad Per Hole (Round) | 1.57 mm | 0.062 " | 0.0625 in | Breadboard General Purpose | 0.037 in | 0.94 mm |