MC68HC11 Series
Manufacturer: Freescale Semiconductor - NXP
IC MCU 8BIT ROMLESS 44QFP
| Part | Speed | Program Memory Type | Oscillator Type | Peripherals | Mounting Type | Connectivity | Core Processor | RAM Size | Core Size | Voltage - Supply (Vcc/Vdd) [Max] | Voltage - Supply (Vcc/Vdd) [Min] | Package / Case | Number of I/O | Operating Temperature [Max] | Operating Temperature [Min] | Data Converters | EEPROM Size [y] | EEPROM Size [x] | Supplier Device Package | RAM Size | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Freescale Semiconductor - NXP | 2 MHz | ROMless | Internal | POR WDT | Surface Mount | SCI SPI | HC11 | 192 x 8 | 8-Bit | 5.5 V | 4.5 V | 44-QFP | 26 I/O | 85 °C | -40 °C | ||||||
Freescale Semiconductor - NXP | ROMless | Internal | POR PWM WDT | Surface Mount | SCI SPI | HC11 | 768 x 8 | 8-Bit | 5.5 V | 4.5 V | 84-LCC (J-Lead) | 37 | 85 °C | -40 °C | A/D 8x8b | 8 | 640 | 84-PLCC (29.29x29.29) | |||
Freescale Semiconductor - NXP | 2 MHz | ROMless | Internal | POR WDT | Surface Mount | SCI SPI | HC11 | 8-Bit | 5.5 V | 4.5 V | 52-LCC (J-Lead) | 125 °C | -40 °C | A/D 8x8b | 512 | ||||||
Freescale Semiconductor - NXP | 4 MHz | ROMless | Internal | POR PWM WDT | Surface Mount | SCI SPI | HC11 | 768 x 8 | 8-Bit | 5.5 V | 4.5 V | 84-LCC (J-Lead) | 37 | 85 °C | -40 °C | A/D 8x8b | 8 | 640 | 84-PLCC (29.29x29.29) | ||
Freescale Semiconductor - NXP | ROMless | External | POR WDT | Surface Mount | SCI SPI | HC11 | 256 x 8 | 8-Bit | 5.5 V | 4.5 V | 52-LCC (J-Lead) | 85 °C | -40 °C | A/D 8x8b | 512 x 8 | ||||||
Freescale Semiconductor - NXP | 4 MHz | ROMless | Internal | POR PWM WDT | Surface Mount | SCI SPI | HC11 | 768 x 8 | 8-Bit | 5.5 V | 4.5 V | 80-QFP | 37 | 85 °C | -40 °C | A/D 8x8b | 8 | 640 | 80-QFP (14x14) | ||
Freescale Semiconductor - NXP | ROMless | Internal | POR PWM WDT | Surface Mount | SCI SPI | HC11 | 768 x 8 | 8-Bit | 5.5 V | 4.5 V | 80-QFP | 37 | 85 °C | -40 °C | A/D 8x8b | 8 | 640 | 80-QFP (14x14) | |||
Freescale Semiconductor - NXP | ROMless | External | POR WDT | Surface Mount | SCI SPI | HC11 | 256 x 8 | 8-Bit | 5.5 V | 4.5 V | 52-LCC (J-Lead) | 125 °C | -40 °C | A/D 8x8b | 512 x 8 | ||||||
Freescale Semiconductor - NXP | ROMless | Internal | POR WDT | Surface Mount | SCI SPI | HC11 | 8-Bit | 5.25 V | 4.75 V | 68-LCC (J-Lead) | 30 I/O | 85 °C | -40 °C | A/D 8x8b | 68-PLCC (24.21x24.21) | 1 K | 512 x 8 | ||||
Freescale Semiconductor - NXP | ROMless | External | POR WDT | Surface Mount | SCI SPI | HC11 | 256 x 8 | 8-Bit | 5.5 V | 4.5 V | 52-LCC (J-Lead) | 85 °C | -40 °C | A/D 8x8b | 512 x 8 |