GD25Q256 Series
Manufacturer: GigaDevice Semiconductor (HK) Limited
IC FLASH 256MBIT SPI/QUAD 8WSON
| Part | Memory Type | Package / Case | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Memory Interface | Memory Format | Technology | Clock Frequency | Supplier Device Package | Memory Size | Voltage - Supply [Max] | Voltage - Supply [Min] | Memory Organization | Access Time | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited | Non-Volatile | 8-WDFN Exposed Pad | Surface Mount | 125 °C | -40 °C | SPI - Quad I/O | FLASH | FLASH - NOR (SLC) | 133 MHz | 8-WSON (6x8) | 256 Gbit | 3.6 V | 2.7 V | 32 M | |||||
GigaDevice Semiconductor (HK) Limited | Non-Volatile | 8-WDFN Exposed Pad | Surface Mount | 85 C | -40 ¯C | SPI - Quad I/O | FLASH | FLASH - NOR (SLC) | 133 MHz | 8-WSON (5x6) | 256 Gbit | 3.6 V | 2.7 V | 32 M | 7 ns | 2 ms | 90 µs | ||
GigaDevice Semiconductor (HK) Limited | Non-Volatile | 8-WDFN Exposed Pad | Surface Mount | 105 °C | -40 °C | SPI - Quad I/O | FLASH | FLASH - NOR (SLC) | 133 MHz | 8-WSON (5x6) | 256 Gbit | 3.6 V | 2.7 V | 32 M | |||||
GigaDevice Semiconductor (HK) Limited | Non-Volatile | 16-SOIC | Surface Mount | 85 C | -40 ¯C | SPI - Quad I/O | FLASH | FLASH - NOR (SLC) | 133 MHz | 16-SOP | 256 Gbit | 3.6 V | 2.7 V | 32 M | 7.5 mm | 0.295 " | |||
GigaDevice Semiconductor (HK) Limited | Non-Volatile | 8-WDFN Exposed Pad | Surface Mount | 105 °C | -40 °C | SPI - Quad I/O | FLASH | FLASH - NOR (SLC) | 133 MHz | 8-WSON (6x8) | 256 Gbit | 3.6 V | 2.7 V | 32 M | |||||
GigaDevice Semiconductor (HK) Limited | Non-Volatile | 16-SOIC | Surface Mount | 85 C | -40 ¯C | SPI - Quad I/O | FLASH | FLASH - NOR | 104 MHz | 16-SOP | 256 Gbit | 3.6 V | 2.7 V | 32 M | 2.4 ms | 50 µs | 7.5 mm | 0.295 " | |
GigaDevice Semiconductor (HK) Limited | Non-Volatile | 8-WDFN Exposed Pad | Surface Mount | 85 C | -40 ¯C | SPI - Quad I/O | FLASH | FLASH - NOR (SLC) | 133 MHz | 8-WSON (6x8) | 256 Gbit | 3.6 V | 2.7 V | 32 M | |||||
GigaDevice Semiconductor (HK) Limited | Non-Volatile | 8-WDFN Exposed Pad | Surface Mount | 85 C | -40 ¯C | SPI - Quad I/O | FLASH | FLASH - NOR (SLC) | 133 MHz | 8-WSON (5x6) | 256 Gbit | 3.6 V | 2.7 V | 32 M | |||||
GigaDevice Semiconductor (HK) Limited | Non-Volatile | 16-SOIC | Surface Mount | 105 °C | -40 °C | SPI - Quad I/O | FLASH | FLASH - NOR (SLC) | 133 MHz | 16-SOP | 256 Gbit | 3.6 V | 2.7 V | 32 M | 7.5 mm | 0.295 " | |||
GigaDevice Semiconductor (HK) Limited | Non-Volatile | 24-TBGA | Surface Mount | 85 C | -40 ¯C | SPI - Quad I/O | FLASH | FLASH - NOR | 104 MHz | 24-TFBGA (6x8) | 256 Gbit | 3.6 V | 2.7 V | 32 M | 2.4 ms | 50 µs |