501940 Series
Manufacturer: Molex
1.00MM PITCH, PICO-CLASP PCB HEADER, SINGLE ROW, VERTICAL, SURFACE MOUNT, 0.10ΜM GOLD PLATED, OUTER POSITIVE LOCK, 5 CIRCUITS, NATURAL
| Part | Connector Type | Mounting Type | Contact Type | Contact Finish - Post | Insulation Height | Insulation Height | Features | Insulation Color | Contact Finish - Mating | Number of Positions Loaded | Contact Shape | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Voltage Rating | Pitch - Mating | Pitch - Mating | Style | Fastening Type | Mated Stacking Heights | Operating Temperature [Min] | Operating Temperature [Max] | Material Flammability Rating | Shrouding | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material | Applications | Number of Rows | Insulation Material | Termination | Insulation Height [z] | Number of Positions |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex | Header | Surface Mount | Male Pin | Gold | 0.179 " | 4.55 mm | Pick and Place Solder Retention | Natural | Gold | All | Square | Varies by Wire Gauge | 0.05 µm | 1.97 µin | 50 V | 0.039 in | 1 mm | Board to Cable/Wire | Locking Ramp | 7.3 mm | -40 °C | 105 ░C | UL94 V-0 | Shrouded - 4 Wall | 0.099 µm | 3.9 µin | Phosphor Bronze | General Purpose | 1 | Nylon Polyamide (PA) | Solder | ||
Molex | Header | Surface Mount | Male Pin | Tin | 5.4 mm | Pick and Place Solder Retention | Natural | All | Square | 0.039 in | 1 mm | Board to Cable/Wire | Locking Ramp | 7.3 mm | UL94 V-0 | Shrouded - 4 Wall | 1 µm | 39.4 µin | Phosphor Bronze | General Purpose | 1 | Nylon Polyamide (PA) | Solder | 0.213 in | |||||||||
Molex | Header | Surface Mount | Male Pin | Tin | 5.4 mm | Pick and Place Solder Retention | Natural | All | Square | 0.039 in | 1 mm | Board to Cable/Wire | Locking Ramp | 7.3 mm | UL94 V-0 | Shrouded - 4 Wall | 1 µm | 39.4 µin | Phosphor Bronze | General Purpose | 1 | Nylon Polyamide (PA) | Solder | 0.213 in | 4 | ||||||||
Molex | Header | Surface Mount | Male Pin | Gold | 0.179 " | 4.55 mm | Pick and Place Solder Retention | Natural | Gold | All | Square | Varies by Wire Gauge | 0.05 µm | 1.97 µin | 50 V | 0.039 in | 1 mm | Board to Cable/Wire | Locking Ramp | 7.3 mm | -40 °C | 105 ░C | UL94 V-0 | Shrouded - 4 Wall | 0.099 µm | 3.9 µin | Phosphor Bronze | General Purpose | 1 | Nylon Polyamide (PA) | Solder | ||
Molex | Header | Surface Mount | Male Pin | Tin | 5.4 mm | Pick and Place Solder Retention | Natural | All | Square | Varies by Wire Gauge | 50 V | 0.039 in | 1 mm | Board to Cable/Wire | Locking Ramp | 7.3 mm | -40 °C | 105 ░C | UL94 V-0 | Shrouded - 4 Wall | 1 µm | 39.4 µin | Phosphor Bronze | General Purpose | 1 | Nylon Polyamide (PA) | Solder | 0.213 in | |||||
Molex |