203566 Series
Manufacturer: Molex
CONN HEADER SMD R/A 30POS 1MM
| Part | Applications | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Style | Termination | Insulation Height | Insulation Height | Number of Positions Loaded | Contact Material | Fastening Type | Number of Rows [custom] | Row Spacing - Mating [x] | Row Spacing - Mating | Material Flammability Rating | Mounting Type | Voltage Rating | Insulation Color | Contact Finish - Mating | Current Rating (Amps) | Shrouding | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions | Contact Type | Features | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Insulation Material | Contact Shape | Connector Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex | Automotive General Purpose Industrial Medical | 4.02 µin | 0.102 µm | Board to Cable/Wire | Solder | 0.325 in | 8.25 mm | All | Phosphor Bronze | Friction Lock | 2 | 0.105 in | 2.66 mm | UL94 V-0 | Right Angle Surface Mount | 50 V | Natural | Gold | Varies by Wire Gauge | Shrouded - 4 Wall | -40 C | 105 ░C | 30 | Male Pin | Solder Retention | Gold | 1 mm | 0.039 in | Nylon Polyamide (PA) | Rectangular | Header | 0.38 µm | 15 µin |
Molex | Automotive General Purpose Industrial Medical | 4.02 µin | 0.102 µm | Board to Cable/Wire | Solder | 0.325 in | 8.25 mm | All | Phosphor Bronze | Friction Lock | 2 | 0.105 in | 2.66 mm | UL94 V-0 | Right Angle Surface Mount | 50 V | Natural | Gold | Varies by Wire Gauge | Shrouded - 4 Wall | -40 C | 105 ░C | 20 | Male Pin | Solder Retention | Gold | 1 mm | 0.039 in | Nylon Polyamide (PA) | Rectangular | Header | 0.38 µm | 15 µin |