GD25LX256 Series
Manufacturer: GigaDevice Semiconductor (HK) Limited
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⌘K
IC FLASH 256MBIT SPI/OCT
| Part | Technology | Mounting Type | Grade | Memory Format | Memory Type | Memory Interface | Operating Temperature [Max] | Operating Temperature [Min] | Supplier Device Package | Memory Size | Voltage - Supply [Min] | Voltage - Supply [Max] | Package / Case | Qualification | Memory Organization | Access Time | Clock Frequency | Package / Case | Package / Case | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 GigaDevice Semiconductor (HK) Limited | FLASH - NOR (SLC) | Surface Mount | Automotive | FLASH | Non-Volatile | SPI - Octal I/O DTR | 125 °C | -40 °C | 24-TFBGA (6x8) | 256 Gbit | 1.65 V | 2 V | 24-TBGA | AEC-Q100 | 32 M | ||||||
GigaDevice Semiconductor (HK) Limited | FLASH - NOR (SLC) | Surface Mount | FLASH | Non-Volatile | SPI - Octal I/O DTR | 105 °C | -40 °C | 24-TFBGA (6x8) | 256 Gbit | 1.65 V | 2 V | 24-TBGA | 32 M | ||||||||
 GigaDevice Semiconductor (HK) Limited | FLASH - NOR (SLC) | Surface Mount | FLASH | Non-Volatile | SPI - Octal I/O DTR | 85 C | -40 ¯C | 16-SOP | 256 Gbit | 1.65 V | 2 V | 16-SOIC | 32 M | 6 ns | 200 MHz | 7.5 mm | 0.295 " | 1.2 ms | 50 µs |