SN74LVC3G34 Series

3-ch, 1.65-V to 5.5-V buffers

Catalog

3-ch, 1.65-V to 5.5-V buffers

Part	Logic Type	Voltage - Supply [Max]	Voltage - Supply [Min]	Operating Temperature [Min]	Operating Temperature [Max]	Number of Bits per Element	Current - Output High, Low [y]	Current - Output High, Low [x]	Supplier Device Package	Mounting Type	Output Type	Package / Case [y]	Package / Case	Package / Case [y]	Supplier Device Package [y]	Supplier Device Package [x]
Texas Instruments SN74LVC3G34DCTR	Buffer Non-Inverting	5.5 V	1.65 V	-40 °C	125 °C	1	32 mA	32 mA	SM8	Surface Mount	Push-Pull
Texas Instruments SN74LVC3G34DCUR	Buffer Non-Inverting	5.5 V	1.65 V	-40 °C	125 °C	1	32 mA	32 mA		Surface Mount	Push-Pull	2.3 mm	8-VFSOP	0.091 in
Texas Instruments SN74LVC3G34DCURG4	Buffer Non-Inverting	5.5 V	1.65 V	-40 °C	125 °C	1	32 mA	32 mA		Surface Mount	Push-Pull	2.3 mm	8-VFSOP	0.091 in
Texas Instruments SN74LVC3G34YZAR	Buffer Non-Inverting	5.5 V	1.65 V	-40 °C	85 °C	1	32 mA	32 mA	8-DSBGA (1.9x0.9)	Surface Mount	Push-Pull		8-XFBGA DSBGA		0.9	1.9
Texas Instruments SN74LVC3G34YZPR	Buffer Non-Inverting	5.5 V	1.65 V	-40 °C	85 °C	1	32 mA	32 mA	8-DSBGA	Surface Mount	Push-Pull		8-XFBGA DSBGA
Texas Instruments SN74LVC3G34YEPR
Texas Instruments SN74LVC3G34DCTRG4	Buffer Non-Inverting	5.5 V	1.65 V	-40 °C	125 °C	1	32 mA	32 mA	SM8	Surface Mount	Push-Pull
Texas Instruments SN74LVC3G34DCUTG4	Buffer Non-Inverting	5.5 V	1.65 V	-40 °C	125 °C	1	32 mA	32 mA		Surface Mount	Push-Pull	2.3 mm	8-VFSOP	0.091 in

Catalog

3-ch, 1.65-V to 5.5-V buffers

Key Features

• Available in the Texas InstrumentsNanoFree PackageSupports 5.5-V VCCOperationInputs Accept Voltages to 5.5 VMax tpdof 4.1 ns at 3.3 VLow Power Consumption, 10-µA Maximum ICC±24-mA Output Drive at 3.3 VTypical VOLP(Output Ground Bounce) <0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot) >2 V at VCC= 3.3 V, TA= 25°CIoffSupports Live Insertion, Partial-Power-Down Mode, and Back-Drive ProtectionCan Be Used as a Down Translator to Translate Inputs From a Maximum of 5.5 V Down to the VCCLevelLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)All trademarks are the property of their respective owners.Available in the Texas InstrumentsNanoFree PackageSupports 5.5-V VCCOperationInputs Accept Voltages to 5.5 VMax tpdof 4.1 ns at 3.3 VLow Power Consumption, 10-µA Maximum ICC±24-mA Output Drive at 3.3 VTypical VOLP(Output Ground Bounce) <0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot) >2 V at VCC= 3.3 V, TA= 25°CIoffSupports Live Insertion, Partial-Power-Down Mode, and Back-Drive ProtectionCan Be Used as a Down Translator to Translate Inputs From a Maximum of 5.5 V Down to the VCCLevelLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)All trademarks are the property of their respective owners.

Description

The SN74LVC3G34 device is a triple buffer gate designed for 1.65-V to 5.5-V VCCoperation. The SN74LVC3G34 device performs the Boolean function Y = A in positive logic. NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The SN74LVC3G34 device is a triple buffer gate designed for 1.65-V to 5.5-V VCCoperation. The SN74LVC3G34 device performs the Boolean function Y = A in positive logic. NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.