SPHWHAHDNH25 Series
Manufacturer: Samsung Semiconductor, Inc.
LED COB C-SER GEN2 WHT SQ 4000K
| Part | Viewing Angle | Light Emitting Surface (LES) [diameter] | CRI (Color Rendering Index) | Lumens/Watt @ Current - Test | Configuration | Current - Max [Max] | Lens Type | Size / Dimension [y] | Size / Dimension [x] | Height [z] | Current - Test | Luminous Flux @ Current/Temperature | Color | Voltage - Forward (Vf) (Typ) | Temperature - Test | CCT (K) | CCT (K) | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung Semiconductor, Inc. | 115 ° | 11.5 mm | 80 | 132 lm/W | Square | 1.38 A | Flat | 19 mm | 19 mm | 1.5 mm | 900 mA | 4154 lm | Neutral White | 35 V | 85 °C | 4000 K | 3-Step MacAdam Ellipse | Chip On Board (COB) |
Samsung Semiconductor, Inc. | 115 ° | 14.5 mm | 80 | 170 lm/W | Square | 1.8 A | Flat | 19 mm | 19 mm | 1.5 mm | 900 mA | 5150 lm | Neutral White | 33.7 V | 85 °C | 4000 K | 3-Step MacAdam Ellipse | Chip On Board (COB) |
Samsung Semiconductor, Inc. | 115 ° | 11.5 mm | 80 | 120 lm/W | Square | 1.38 A | Flat | 19 mm | 19 mm | 1.5 mm | 900 mA | 3765 lm | Warm White | 35 V | 85 °C | 2700 K | 3-Step MacAdam Ellipse | Chip On Board (COB) |
Samsung Semiconductor, Inc. | 115 ° | 14.5 mm | 80 | 161 lm/W | Square | 1.8 A | Flat | 19 mm | 19 mm | 1.5 mm | 900 mA | 4875 lm | Warm White | 33.7 V | 85 °C | 3000 K | 3-Step MacAdam Ellipse | Chip On Board (COB) |
Samsung Semiconductor, Inc. | 115 ° | 14.5 mm | 80 | 163 lm/W | Square | 2.3 A | Flat | 19 mm | 19 mm | 1.5 mm | 900 mA | 4989 lm | Warm White | 34 V | 85 °C | 3500 K | 3-Step MacAdam Ellipse | Chip On Board (COB) |
Samsung Semiconductor, Inc. | 115 ° | 14.5 mm | 80 | 167 lm/W | Square | 2.3 A | Flat | 19 mm | 19 mm | 1.7 mm | 900 mA | 5044 lm | Warm White | 33.6 V | 85 °C | 3000 K | 3-Step MacAdam Ellipse | Chip On Board (COB) |
Samsung Semiconductor, Inc. | 115 ° | 14.5 mm | 80 | 168 lm/W | Square | 2.3 A | Flat | 19 mm | 19 mm | 1.5 mm | 900 mA | 5132 lm | Cool White | 34 V | 85 °C | 5700 K | 3-Step MacAdam Ellipse | Chip On Board (COB) |
Samsung Semiconductor, Inc. | 115 ° | 11.5 mm | 80 | 126 lm/W | Square | 1.38 A | Flat | 19 mm | 19 mm | 1.5 mm | 900 mA | 3956 lm | Warm White | 35 V | 85 °C | 3000 K | 3-Step MacAdam Ellipse | Chip On Board (COB) |
Samsung Semiconductor, Inc. | 115 ° | 14.5 mm | 80 | 156 lm/W | Square | 1.8 A | Flat | 19 mm | 19 mm | 1.5 mm | 900 mA | 4779 lm | Warm White | 34 V | 85 °C | 3500 K | 3-Step MacAdam Ellipse | Chip On Board (COB) |
Samsung Semiconductor, Inc. | 115 ° | 14.5 mm | 80 | 142 lm/W | Square | 2.3 A | Flat | 19 mm | 19 mm | 1.5 mm | 900 mA | 4418 lm | Warm White | 34.6 V | 85 °C | 2700 K | 2-Step MacAdam Ellipse | Chip On Board (COB) |