SN74LVC2G06 Series

2-ch, 1.65-V to 5.5-V inverters with open-drain outputs

Catalog

2-ch, 1.65-V to 5.5-V inverters with open-drain outputs

Part	Features	Current - Output High, Low [custom]	Current - Output High, Low [custom]	Input Logic Level - Low [Max]	Input Logic Level - Low [Min]	Input Logic Level - High [Min]	Input Logic Level - High [Max]	Mounting Type	Package / Case	Logic Type	Supplier Device Package	Voltage - Supply [Max]	Voltage - Supply [Min]	Operating Temperature [Max]	Operating Temperature [Min]	Number of Inputs	Number of Circuits	Max Propagation Delay @ V, Max CL	Current - Quiescent (Max) [Max]
Texas Instruments SN74LVC2G06DSFR	Open Drain	-	32 mA	0.8 V	0.7 V	1.7 V	2 V	Surface Mount	6-XFDFN	Inverter	6-SON (1x1)	5.5 V	1.65 V	125 °C	-40 °C	2	2	2.9 ns	10 µA
Texas Instruments SN74LVC2G06MDCKREP	Open Drain	-	32 mA	0.8 V	0.7 V	1.7 V	2 V	Surface Mount	6-TSSOP SC-88 SOT-363	Inverter	SC-70-6	5.5 V	1.65 V	125 °C	-55 °C	2	2	3.9 ns	10 µA
Texas Instruments SN74LVC2G06DCKRE4	Open Drain	-	32 mA	0.8 V	0.7 V	1.7 V	2 V	Surface Mount	6-TSSOP SC-88 SOT-363	Inverter	SC-70-6	5.5 V	1.65 V	125 °C	-40 °C	2	2	2.9 ns	10 µA
Texas Instruments SN74LVC2G06YEPR	Open Drain	-	32 mA	0.8 V	0.7 V	1.7 V	2 V	Surface Mount	6-XFBGA DSBGA	Inverter	6-DSBGA	5.5 V	1.65 V	85 °C	-40 °C	2	2	2.9 ns	10 µA
Texas Instruments SN74LVC2G06YZPR	Open Drain	-	32 mA	0.8 V	0.7 V	1.7 V	2 V	Surface Mount	6-XFBGA DSBGA	Inverter	6-DSBGA	5.5 V	1.65 V	85 °C	-40 °C	2	2	2.9 ns	10 µA
Texas Instruments SN74LVC2G06DBVR	Open Drain	-	32 mA	0.8 V	0.7 V	1.7 V	2 V	Surface Mount	SOT-23-6	Inverter	SOT-23-6	5.5 V	1.65 V	125 °C	-40 °C	2	2	2.9 ns	10 µA

Catalog

2-ch, 1.65-V to 5.5-V inverters with open-drain outputs

Key Features

• Available in the Texas InstrumentsPackageSupports 5-V VCCOperationMax tpdof 3.4 ns at 3.3 VLow Power Consumption, 10-µA Max ICC±24-mA Output Drive at 3.3 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot)>2 V at VCC= 3.3 V, TA= 25°CInputs and Open-Drain Outputs AcceptVoltages up to 5.5 VIoffSupports Live Insertion, Partial-Power-DownMode and Back-Drive ProtectionLatch-Up Performance Exceeds 100 mA PerJESD 78, Class IISupports Down-Translation(5 V to 3.3 V and 3.3 V to 1.8 V)ESD Protection Exceeds JESD 222000-V Human Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)Available in the Texas InstrumentsPackageSupports 5-V VCCOperationMax tpdof 3.4 ns at 3.3 VLow Power Consumption, 10-µA Max ICC±24-mA Output Drive at 3.3 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot)>2 V at VCC= 3.3 V, TA= 25°CInputs and Open-Drain Outputs AcceptVoltages up to 5.5 VIoffSupports Live Insertion, Partial-Power-DownMode and Back-Drive ProtectionLatch-Up Performance Exceeds 100 mA PerJESD 78, Class IISupports Down-Translation(5 V to 3.3 V and 3.3 V to 1.8 V)ESD Protection Exceeds JESD 222000-V Human Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)

Description

This dual inverter buffer and driver is designed for 1.65-V to 5.5-V VCCoperation. The output of the SN74LVC2G06 device is an open-drain which can be connected to other open-drain outputs to implement active-low, wired-OR, or active-high wired-AND functions. The maximum sink current is 32 mA. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This dual inverter buffer and driver is designed for 1.65-V to 5.5-V VCCoperation. The output of the SN74LVC2G06 device is an open-drain which can be connected to other open-drain outputs to implement active-low, wired-OR, or active-high wired-AND functions. The maximum sink current is 32 mA. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.