70-3213 Series
Manufacturer: Kester Solder
SOLDER PASTE NXG1 NO CLEAN 500GM
| Part | Shipping Info | Shelf Life | Form | Form | Composition | Shelf Life Start | Mesh Type | Flux Type | Melting Point [Max] | Melting Point [Min] | Melting Point [Min] | Melting Point [Max] | Type | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Max] | Form |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Kester Solder | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | 8 Months | 17.64 oz 500 g | Jar | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Date of Manufacture | 3 | No-Clean | 218 °C | 217 °C | 423 °F | 424 °F | Solder Paste | 32 °F | 10 °C | |
Kester Solder | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | 8 Months | 600 g | Cartridge | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Date of Manufacture | 3 | No-Clean | 218 °C | 217 °C | 423 °F | 424 °F | Solder Paste | 32 °F | 10 °C | 21.16 oz |