MDT275 Series

Catalog

CONN M.2 FMALE 67POS 0.020 GOLD

Part	Material - Insulation	Number of Positions	Read Out	Contact Finish Thickness	Card Type	Contact Material	Operating Temperature [Max]	Operating Temperature [Min]	Gender	Color	Number of Rows [custom]	Mounting Type	Features	Pitch	Pitch	Contact Finish	Termination	Contact Finish Thickness	Contact Finish Thickness
Amphenol ICC (FCI) MDT275A03001	Liquid Crystal Polymer (LCP)	67	Dual	Flash	M.2 (NGFF) Mini Card	Copper Alloy	80 °C	-40 C	Female	Black	2	Right Angle Surface Mount	Board Lock Keyed A	0.02 "	0.5 mm	Gold	Solder
Amphenol ICC (FCI) MDT275E03001	Liquid Crystal Polymer (LCP)	67	Dual	Flash	M.2 (NGFF) Mini Card	Copper Alloy	80 °C	-40 C	Female	Black	2	Right Angle Surface Mount	Board Lock Keyed E	0.02 "	0.5 mm	Gold	Solder
Amphenol ICC (FCI) MDT275A01001	Liquid Crystal Polymer (LCP)	67	Dual		M.2 (NGFF) Mini Card	Copper Alloy	80 °C	-40 C	Female	Black	2	Right Angle Surface Mount	Board Lock Keyed	0.02 "	0.5 mm	Gold	Solder	30 Áin	0.76 Ám
Amphenol ICC (FCI) MDT275E02001	Liquid Crystal Polymer (LCP)	67	Dual		M.2 (NGFF) Mini Card	Copper Alloy	80 °C	-40 C	Female	Black	2	Right Angle Surface Mount	Board Lock Keyed E	0.02 "	0.5 mm	Gold	Solder	15 µin	0.38 µm
Amphenol ICC (FCI) MDT275A02001	Liquid Crystal Polymer (LCP)	67	Dual		M.2 (NGFF) Mini Card	Copper Alloy	80 °C	-40 C	Female	Black	2	Right Angle Surface Mount	Board Lock Keyed A	0.02 "	0.5 mm	Gold	Solder	15 µin	0.38 µm
Amphenol ICC (FCI) MDT275M03001	Liquid Crystal Polymer (LCP)	67	Dual	Flash	M.2 (NGFF) Mini Card	Copper Alloy	80 °C	-40 C	Female	Black	2	Right Angle Surface Mount	Board Lock Keyed M	0.02 "	0.5 mm	Gold	Solder
Amphenol ICC (FCI) MDT275B01001	Liquid Crystal Polymer (LCP)	67	Dual		M.2 (NGFF) Mini Card	Copper Alloy	80 °C	-40 C	Female	Black	2	Right Angle Surface Mount	Board Lock Keyed B	0.02 "	0.5 mm	Gold	Solder	30 Áin	0.76 Ám