SN74LVC541A-EP Series

Enhanced product 8-ch, 2-V to 3.6-V buffers with 3-state outputs

Catalog

Enhanced product 8-ch, 2-V to 3.6-V buffers with 3-state outputs

Part	Operating Temperature [Min]	Operating Temperature [Max]	Number of Bits per Element	Package / Case	Supplier Device Package	Current - Output High, Low	Output Type	Logic Type	Number of Elements	Voltage - Supply [Min]	Voltage - Supply [Max]	Mounting Type	Package / Case [y]	Package / Case [x]	Grade	Qualification	Package / Case [y]
Texas Instruments SN74LVC541ADB
Texas Instruments SN74LVC541ADBRG4	-40 °C	125 °C	8	20-SSOP	20-SSOP	24 mA	3-State	Buffer Non-Inverting	1	1.65 V	3.6 V	Surface Mount
Texas Instruments SN74LVC541AQPWRQ1	-40 °C	125 °C	8	20-TSSOP	20-TSSOP	24 mA	3-State	Buffer Non-Inverting	1	2 V	3.6 V	Surface Mount	4.4 mm	0.173 in	Automotive	AEC-Q100
Texas Instruments SN74LVC541AQDWRQ1	-40 °C	125 °C	8	20-SOIC	20-SOIC	24 mA	3-State	Buffer Non-Inverting	1	2 V	3.6 V	Surface Mount	0.295 in		Automotive	AEC-Q100	7.5 mm
Texas Instruments SN74LVC541ADGVRG4	-40 °C	125 °C	8	20-TFSOP	20-TVSOP	24 mA	3-State	Buffer Non-Inverting	1	1.65 V	3.6 V	Surface Mount	0.173 in				4.4 mm
Texas Instruments SN74LVC541APWRE4	-40 °C	125 °C	8	20-TSSOP	20-TSSOP	24 mA	3-State	Buffer Non-Inverting	1	1.65 V	3.6 V	Surface Mount	4.4 mm	0.173 in
Texas Instruments SN74LVC541ARGYR	-40 °C	125 °C	8	20-VFQFN Exposed Pad	20-VQFN (3.5x4.5)	24 mA	3-State	Buffer Non-Inverting	1	1.65 V	3.6 V	Surface Mount
Texas Instruments SN74LVC541ADBR	-40 °C	125 °C	8	20-SSOP	20-SSOP	24 mA	3-State	Buffer Non-Inverting	1	1.65 V	3.6 V	Surface Mount
Texas Instruments SN74LVC541ADGVRE4	-40 °C	125 °C	8	20-TFSOP	20-TVSOP	24 mA	3-State	Buffer Non-Inverting	1	1.65 V	3.6 V	Surface Mount	0.173 in				4.4 mm
Texas Instruments SN74LVC541AQPWREP	-40 °C	125 °C	8	20-TSSOP	20-TSSOP	24 mA	3-State	Buffer Non-Inverting	1	2 V	3.6 V	Surface Mount	4.4 mm	0.173 in

Catalog

Enhanced product 8-ch, 2-V to 3.6-V buffers with 3-state outputs

Key Features

• Controlled BaselineOne Assembly/Test Site, One Fabrication SiteExtended Temperature Performance of –40°C to 125°CEnhanced Diminishing Manufacturing Sources (DMS) SupportEnhanced Product-Change NotificationQualification PedigreeOperates From 2 V to 3.6 VInputs Accept Voltages to 5.5 VMax tpdof 5.1 ns at 3.3 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot)>2 V at VCC= 3.3 V, TA= 25°CSupports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC)IoffSupports Partial-Power-Down Mode OperationComponent qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.Controlled BaselineOne Assembly/Test Site, One Fabrication SiteExtended Temperature Performance of –40°C to 125°CEnhanced Diminishing Manufacturing Sources (DMS) SupportEnhanced Product-Change NotificationQualification PedigreeOperates From 2 V to 3.6 VInputs Accept Voltages to 5.5 VMax tpdof 5.1 ns at 3.3 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot)>2 V at VCC= 3.3 V, TA= 25°CSupports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC)IoffSupports Partial-Power-Down Mode OperationComponent qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

Description

The SN54LVC541A octal buffer/driver is designed for 2.7-V to 3.6-V VCCoperation, and the SN74LVC541A octal buffer/driver is designed for 1.65-V to 3.6-V VCCoperation. The ’LVC541A devices are ideal for driving bus lines or buffering memory address registers. These devices feature inputs and outputs on opposite sides of the package to facilitate printed circuit board layout. The 3-state control gate is a 2-input AND gate with active-low inputs so that, if either output enable (OE1orOE2) input is high, all eight outputs are in the high-impedance state. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators in a mixed 3.3-V/5-V system environment. These devices are fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. To ensure the high-impedance state during power up or power down,OEshould be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN54LVC541A octal buffer/driver is designed for 2.7-V to 3.6-V VCCoperation, and the SN74LVC541A octal buffer/driver is designed for 1.65-V to 3.6-V VCCoperation. The ’LVC541A devices are ideal for driving bus lines or buffering memory address registers. These devices feature inputs and outputs on opposite sides of the package to facilitate printed circuit board layout. The 3-state control gate is a 2-input AND gate with active-low inputs so that, if either output enable (OE1orOE2) input is high, all eight outputs are in the high-impedance state. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators in a mixed 3.3-V/5-V system environment. These devices are fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. To ensure the high-impedance state during power up or power down,OEshould be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.