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110-87 Series

Manufacturer: Preci-Dip

Catalog

CONN IC DIP SOCKET 16POS GOLD

PartPitch - MatingFeaturesContact Material - MatingContact Finish - PostMounting TypeContact Finish - MatingRow SpacingTypeGrid RowsNumber of Positions or Pins (Grid)Grid ColumnsTerminationPitch - PostHousing MaterialContact Material - PostOperating Temperature (Max)Operating Temperature (Min)Contact Finish Thickness - MatingMaterial Flammability RatingTermination Post LengthCurrent RatingContact Resistance
0.1 in
Open Frame
Beryllium Copper
Tin
Through Hole
Gold
0.3 in
0.3" (7.62mm) Row Spacing
DIP
2
16
8
Solder
0.1 in
Glass Filled
PCT
Polycyclohexylenedimethylene Terephthalate
Polyester
Brass
125 °C
-55 °C
Flash
UL94 V-0
0.125 in
1 A
10 mOhm
0.1 in
Open Frame
Beryllium Copper
Tin
Surface Mount
Gold
0.3 in
0.3" (7.62mm) Row Spacing
DIP
2
8
4
Solder
0.1 in
Glass Filled
PCT
Polycyclohexylenedimethylene Terephthalate
Polyester
Brass
125 °C
-55 °C
Flash
UL94 V-0
0.118 in
1 A
10 mOhm
0.1 in
Open Frame
Beryllium Copper
Tin
Surface Mount
Gold
0.6 in
0.6" (15.24mm) Row Spacing
DIP
2
42
21
Solder
0.1 in
Glass Filled
PCT
Polycyclohexylenedimethylene Terephthalate
Polyester
Brass
125 °C
-55 °C
Flash
UL94 V-0
0.118 in
1 A
10 mOhm
0.1 in
Open Frame
Beryllium Copper
Tin
Surface Mount
Gold
0.3 in
0.3" (7.62mm) Row Spacing
DIP
2
22
11
Solder
0.1 in
Glass Filled
PCT
Polycyclohexylenedimethylene Terephthalate
Polyester
Brass
125 °C
-55 °C
Flash
UL94 V-0
0.118 in
1 A
10 mOhm
0.1 in
Open Frame
Beryllium Copper
Tin
Surface Mount
Gold
0.3 in
0.3" (7.62mm) Row Spacing
DIP
2
14
7
Solder
0.1 in
Glass Filled
PCT
Polycyclohexylenedimethylene Terephthalate
Polyester
Brass
125 °C
-55 °C
Flash
UL94 V-0
0.118 in
1 A
10 mOhm
0.1 in
Open Frame
Beryllium Copper
Tin
Through Hole
Gold
0.9 in
0.9" (22.86mm) Row Spacing
DIP
2
50
25
Solder
0.1 in
Glass Filled
PCT
Polycyclohexylenedimethylene Terephthalate
Polyester
Brass
125 °C
-55 °C
Flash
UL94 V-0
0.125 in
1 A
10 mOhm
0.1 in
Open Frame
Beryllium Copper
Tin
Through Hole
Gold
0.3 in
0.3" (7.62mm) Row Spacing
DIP
2
8
4
Solder
0.1 in
Glass Filled
PCT
Polycyclohexylenedimethylene Terephthalate
Polyester
Brass
125 °C
-55 °C
Flash
UL94 V-0
0.125 in
1 A
10 mOhm
0.1 in
Open Frame
Beryllium Copper
Tin
Surface Mount
Gold
0.3 in
0.3" (7.62mm) Row Spacing
DIP
2
10
5
Solder
0.1 in
Glass Filled
PCT
Polycyclohexylenedimethylene Terephthalate
Polyester
Brass
125 °C
-55 °C
Flash
UL94 V-0
0.118 in
1 A
10 mOhm
0.1 in
Open Frame
Beryllium Copper
Tin
Surface Mount
Gold
0.3 in
0.3" (7.62mm) Row Spacing
DIP
2
14
7
Solder
0.1 in
Glass Filled
PCT
Polycyclohexylenedimethylene Terephthalate
Polyester
Brass
125 °C
-55 °C
Flash
UL94 V-0
0.118 in
1 A
10 mOhm
0.1 in
Open Frame
Beryllium Copper
Tin
Through Hole
Gold
0.6 in
0.6" (15.24mm) Row Spacing
DIP
2
40
20
Solder
0.1 in
Glass Filled
PCT
Polycyclohexylenedimethylene Terephthalate
Polyester
Brass
125 °C
-55 °C
Flash
UL94 V-0
1 A
10 mOhm