BDN09 Series
Manufacturer: CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE .91"SQ
| Part | Shelf Life | Fin Height [custom] | Fin Height | Thermal Resistance @ Natural | Attachment Method | Length [x] | Length [x] | Shape | Thermal Resistance @ Forced Air Flow | Material Finish | Package Cooled | Type | Material | Width [x] | Width [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CTS Thermal Management Products | 24 Months | 0.355 in | 9.02 mm | 26.9 °C/W | Thermal Tape Adhesive (Included) | 23.11 mm | 0.91 in | Pin Fins Square | 9.6 °C/W | Black Anodized | ASIC BGA CPU LGA | Top Mount | Aluminum | 0.91 in | 23.11 mm |
CTS Thermal Management Products | 0.355 in | 9.02 mm | 26.9 °C/W | Thermal Tape Adhesive | 23.11 mm | 0.91 in | Pin Fins Square | 9.6 °C/W | Black Anodized | ASIC BGA CPU LGA | Top Mount | Aluminum | 0.91 in | 23.11 mm |