ESD7571 Series

Micro−Packaged Diodes for ESD Protection

Catalog

Micro−Packaged Diodes for ESD Protection

Part	Applications	Type	Voltage - Reverse Standoff (Typ)	Grade	Package / Case	Bidirectional Channels [custom]	Power Line Protection	Qualification	Supplier Device Package	Supplier Device Package [y]	Supplier Device Package [x]	Voltage - Breakdown (Min) [Min]	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Voltage - Clamping (Max) @ Ipp [Max]
ON Semiconductor SZESD7571N2T5G	USB	Zener	5.3 V	Automotive	2-XDFN	1		AEC-Q101	2-X2DFN	0.6	1	7 V	-55 °C	150 °C	Surface Mount	15 V

Catalog

Micro−Packaged Diodes for ESD Protection

Key Features

• Industry Leading Capacitance Linearity Over Voltage

• Ultra−Low Capacitance: 0.35 pF Max

• Low Leakage: < 1 nA

• Low Dynamic Resistance: < 1 Ω

• 1000 ESD IEC61000−4−2 Strikes ±8 kV Contact / Air Discharged

• IEC61000−4−2 Level 4 ESD Protection

• SZ Prefix for Automotive and Other Applications Requiring UniqueSite and Control Change Requirements; AEC−Q101 Qualified andPPAP Capable

• Stand−off Voltage: 5.3 V

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHSCompliant

• SZESD7571MXWT5G Wettable Flank Package

Description

The ESD7571 is designed to protect voltage sensitive componentsthat require ultra-low capacitance from ESD and transient voltageevents. Excellent clamping capability, low capacitance, highbreakdown voltage, high linearity, low leakage, and fast response timemake these parts ideal for ESD protection on designs where boardspace is at a premium. It has industry leading capacitance linearityover voltage making it ideal for RF applications. This capacitancelinearity combined with the extremely small package and lowinsertion loss makes this part well suited for use in antenna lineapplications for wireless handsets and terminals.