SN74LVTH125-EP Series

Enhanced product 4-ch, 2.7-V to 3.6-V buffers with bus-hold, TTL-compatible CMOS inputs and 3-state

Catalog

Enhanced product 4-ch, 2.7-V to 3.6-V buffers with bus-hold, TTL-compatible CMOS inputs and 3-state

Part	Operating Temperature [Max]	Operating Temperature [Min]	Voltage - Supply [Min]	Voltage - Supply [Max]	Output Type	Logic Type	Mounting Type	Number of Elements	Current - Output High, Low [custom]	Current - Output High, Low [custom]	Package / Case [x]	Package / Case [y]	Package / Case	Number of Bits per Element	Supplier Device Package	Package / Case [custom]	Package / Case [custom]
Texas Instruments SN74LVTH125DR	85 °C	-40 °C	2.7 V	3.6 V	3-State	Buffer Non-Inverting	Surface Mount	4	64 mA	32 mA	0.154 in	3.9 mm	14-SOIC	1
Texas Instruments SN74LVTH125NSRE4	85 °C	-40 °C	2.7 V	3.6 V	3-State	Buffer Non-Inverting	Surface Mount	4	64 mA	32 mA	0.209 "	5.3 mm	14-SOIC	1	14-SO
Texas Instruments SN74LVTH125PW	85 °C	-40 °C	2.7 V	3.6 V	3-State	Buffer Non-Inverting	Surface Mount	4	64 mA	32 mA			14-TSSOP	1	14-TSSOP	0.173 "	4.4 mm
Texas Instruments SN74LVTH125DRE4	85 °C	-40 °C	2.7 V	3.6 V	3-State	Buffer Non-Inverting	Surface Mount	4	64 mA	32 mA	0.154 in	3.9 mm	14-SOIC	1
Texas Instruments SN74LVTH125PWR	85 °C	-40 °C	2.7 V	3.6 V	3-State	Buffer Non-Inverting	Surface Mount	4	64 mA	32 mA			14-TSSOP	1	14-TSSOP	0.173 "	4.4 mm
Texas Instruments SN74LVTH125NSR	85 °C	-40 °C	2.7 V	3.6 V	3-State	Buffer Non-Inverting	Surface Mount	4	64 mA	32 mA	0.209 "	5.3 mm	14-SOIC	1	14-SO
Texas Instruments SN74LVTH125PWE4	85 °C	-40 °C	2.7 V	3.6 V	3-State	Buffer Non-Inverting	Surface Mount	4	64 mA	32 mA			14-TSSOP	1	14-TSSOP	0.173 "	4.4 mm
Texas Instruments SN74LVTH125DRG4	85 °C	-40 °C	2.7 V	3.6 V	3-State	Buffer Non-Inverting	Surface Mount	4	64 mA	32 mA	0.154 in	3.9 mm	14-SOIC	1
Texas Instruments SN74LVTH125PWRE4	85 °C	-40 °C	2.7 V	3.6 V	3-State	Buffer Non-Inverting	Surface Mount	4	64 mA	32 mA			14-TSSOP	1	14-TSSOP	0.173 "	4.4 mm
Texas Instruments SN74LVTH125PWRG4	85 °C	-40 °C	2.7 V	3.6 V	3-State	Buffer Non-Inverting	Surface Mount	4	64 mA	32 mA			14-TSSOP	1	14-TSSOP	0.173 "	4.4 mm

Catalog

Enhanced product 4-ch, 2.7-V to 3.6-V buffers with bus-hold, TTL-compatible CMOS inputs and 3-state

Key Features

• Controlled BaselineOne Assembly/Test Site, One Fabrication SiteEnhanced Diminishing Manufacturing Sources (DMS) SupportEnhanced Product-Change NotificationQualification PedigreeSupports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)Supports Unregulated Battery Operation Down to 2.7 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CIoffand Power-Up 3-State Support Hot InsertionBus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown ResistorsLatch-Up Performance Exceeds 500 mA Per JESD 17ESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.Controlled BaselineOne Assembly/Test Site, One Fabrication SiteEnhanced Diminishing Manufacturing Sources (DMS) SupportEnhanced Product-Change NotificationQualification PedigreeSupports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)Supports Unregulated Battery Operation Down to 2.7 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CIoffand Power-Up 3-State Support Hot InsertionBus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown ResistorsLatch-Up Performance Exceeds 500 mA Per JESD 17ESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

Description

These bus buffers are designed specifically for low-voltage (3.3-V) VCCoperation, but with the capability to provide a TTL interface to a 5-V system environment. The ’LVTH125 devices feature independent line drivers with 3-state outputs. Each output is in the high-impedance state when the associated output-enable (OE)\ input is high. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. When VCCis between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE\ should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. These devices are fully specified for hot-insertion applications using Ioffand power-up 3-state. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. These bus buffers are designed specifically for low-voltage (3.3-V) VCCoperation, but with the capability to provide a TTL interface to a 5-V system environment. The ’LVTH125 devices feature independent line drivers with 3-state outputs. Each output is in the high-impedance state when the associated output-enable (OE)\ input is high. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. When VCCis between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE\ should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. These devices are fully specified for hot-insertion applications using Ioffand power-up 3-state. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.