10083987 Series
Manufacturer: Amphenol ICC (FCI)
CONN PCI EXP
| Part | Features | Contact Type | Card Thickness | Card Thickness | Termination | Color | Read Out | Material - Insulation | Number of Positions | Card Type | Pitch [x] | Pitch [x] | Mounting Type | Number of Positions/Bay/Row [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish Thickness | Contact Finish Thickness | Contact Finish | Contact Material | Gender | Number of Rows | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | Board Guide | Cantilever | 0.062 in | 1.57 mm | Solder | Black | Dual | Thermoplastic Glass Filled | 164 | PCI Express™ | 0.039 in | 1 mm | Through Hole | 82 | 85 °C | -55 °C | 0.76 Ám | 30 Áin | Gold | Copper Alloy | Female | ||
Amphenol ICC (FCI) | Board Guide Card Latch Locking Ramp | Cantilever | 0.062 in | 1.57 mm | Solder Staggered | Black | Dual | Thermoplastic Glass Filled | 164 | PCI Express™ | 0.039 in | 1 mm | Through Hole | 85 °C | -55 °C | Gold | Copper Alloy | Female | 2 | Flash | |||
Amphenol ICC (FCI) | Board Guide Card Latch Locking Ramp | Cantilever | 0.062 in | 1.57 mm | Solder Staggered | Black | Dual | Thermoplastic Glass Filled | 164 | PCI Express™ | 0.039 in | 1 mm | Through Hole | 85 °C | -55 °C | 0.76 Ám | 30 Áin | Gold | Copper Alloy | Female | 2 | ||
Amphenol ICC (FCI) | Board Guide Card Latch Locking Ramp | Cantilever | 0.062 in | 1.57 mm | Solder Staggered | Black | Dual | Thermoplastic Glass Filled | 164 | PCI Express™ | 0.039 in | 1 mm | Through Hole | 85 °C | -55 °C | 0.38 µm | 15 µin | Gold | Copper Alloy | Female | 2 | ||
Amphenol ICC (FCI) | Board Guide Card Latch Locking Ramp | Cantilever | 0.062 in | 1.57 mm | Solder Staggered | Blue | Dual | Thermoplastic Glass Filled | 164 | PCI Express™ | 0.039 in | 1 mm | Through Hole | 85 °C | -55 °C | Gold | Copper Alloy | Female | 2 | Flash |