10083987 Series

Catalog

CONN PCI EXP

Part	Material - Insulation	Number of Positions/Bay/Row	Card Type	Pitch	Pitch	Color	Contact Finish	Number of Positions	Features	Contact Type	Contact Material	Read Out	Card Thickness	Card Thickness	Contact Finish Thickness	Contact Finish Thickness	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Mounting Type	Gender	Contact Finish Thickness	Number of Rows [custom]
Amphenol ICC (FCI) 10083987-71123TLF	Thermoplastic Glass Filled	82	PCI Express™	1 mm	0.039 in	Black	Gold	164	Board Guide	Cantilever	Copper Alloy	Dual	1.57 mm	0.062 in	30 Áin	0.76 Ám	-55 C	85 °C	Solder	Through Hole	Female
Amphenol ICC (FCI) 10083987-11213TLF	Thermoplastic Glass Filled		PCI Express™	1 mm	0.039 in	Black	Gold	164	Board Guide Card Latch Locking Ramp	Cantilever	Copper Alloy	Dual	1.57 mm	0.062 in			-55 C	85 °C	Solder Staggered	Through Hole	Female	Flash	2
Amphenol ICC (FCI) 10083987-11223TLF	Thermoplastic Glass Filled		PCI Express™	1 mm	0.039 in	Black	Gold	164	Board Guide Card Latch Locking Ramp	Cantilever	Copper Alloy	Dual	1.57 mm	0.062 in			-55 C	85 °C	Solder Staggered	Through Hole	Female	Flash	2
Amphenol ICC (FCI) 10083987-11013TLF	Thermoplastic Glass Filled		PCI Express™	1 mm	0.039 in	Black	Gold	164	Board Guide Card Latch Locking Ramp	Cantilever	Copper Alloy	Dual	1.57 mm	0.062 in	30 Áin	0.76 Ám	-55 C	85 °C	Solder Staggered	Through Hole	Female		2
Amphenol ICC (FCI) 10083987-11123TLF	Thermoplastic Glass Filled		PCI Express™	1 mm	0.039 in	Black	Gold	164	Board Guide Card Latch Locking Ramp	Cantilever	Copper Alloy	Dual	1.57 mm	0.062 in	15 µin	0.38 µm	-55 C	85 °C	Solder Staggered	Through Hole	Female		2
Amphenol ICC (FCI) 10083987-41223TLF	Thermoplastic Glass Filled		PCI Express™	1 mm	0.039 in	Blue	Gold	164	Board Guide Card Latch Locking Ramp	Cantilever	Copper Alloy	Dual	1.57 mm	0.062 in			-55 C	85 °C	Solder Staggered	Through Hole	Female	Flash	2