633 Series
Manufacturer: EDAC Inc.
D-SUB STANDARD CONNECTORS RIGHT ANGLE D-SUB CONNECTOR
| Part | Connector Style | Features | Contact Type | Number of Rows [custom] | Shell Material, Finish | Flange Feature | Flange Feature | Termination | Material Flammability Rating | Contact Finish | Backset Spacing | Backset Spacing | Current Rating (Amps) | Number of Positions | Contact Finish Thickness | Contact Finish Thickness | Mounting Type | Shell Size, Connector Layout [custom] | Shell Size, Connector Layout | Connector Type | Shell Size, Connector Layout [custom] | Operating Temperature [Min] | Operating Temperature [Max] | Dielectric Material | Contact Material | Shell Size, Connector Layout | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
EDAC Inc. | D-Sub High Density | Board Lock Grounding Indents Mounting Brackets Shielded | Signal | 3 | Nickel Plated Steel | Housing/Shell | 4-40 | Solder | UL94 V-0 | Gold | 8.89 mm | 0.35 in | 3 A | 26 | 0.38 µm | 15 µin | Board Edge Right Angle Through Hole | 2 | DA A | Plug Male Pins | |||||||
EDAC Inc. | D-Sub High Density | Grounding Indents Mounting Brackets Shielded | Signal | 3 | Nickel Plated Steel | Housing/Shell (Unthreaded) | Solder | UL94 V-0 | Gold | 8.89 mm | 0.35 in | 3 A | 15 | 0.76 Ám | 30 Áin | Board Edge Right Angle Through Hole | 1 | Plug Male Pins | (DE E) High Density | ||||||||
EDAC Inc. | D-Sub High Density | Grounding Indents Mounting Brackets Shielded | Signal | 3 | Nickel Plated Steel | Housing/Shell (Unthreaded) | Solder | UL94 V-0 | Gold | 8.89 mm | 0.35 in | 3 A | 44 | 0.38 µm | 15 µin | Board Edge Right Angle Through Hole | Plug Male Pins | -55 C | 85 °C | Polyester Thermoplastic | Copper Alloy | 3 | |||||
EDAC Inc. | D-Sub High Density | Board Lock Grounding Indents Mounting Brackets Shielded | Signal | 3 | Nickel Plated Steel | Housing/Shell | 4-40 | Solder | UL94 V-0 | Gold | 8.89 mm | 0.35 in | 3 A | 15 | Board Edge Right Angle Through Hole | 1 | Plug Male Pins | (DE E) High Density | Flash | ||||||||
EDAC Inc. | D-Sub High Density | Board Lock Grounding Indents Mounting Brackets Shielded | Signal | 3 | Nickel Plated Steel | Housing/Shell (M3) | Solder | UL94 V-0 | Gold | 8.89 mm | 0.35 in | 3 A | 15 | Board Edge Right Angle Through Hole | 1 | Plug Male Pins | (DE E) High Density | -55 C | 85 °C | Polyester Thermoplastic | Copper Alloy | Flash | |||||
EDAC Inc. | D-Sub High Density | Board Lock Grounding Indents Mounting Brackets Shielded | Signal | 3 | Nickel Plated Steel | Housing/Shell | 4-40 | Solder | UL94 V-0 | Gold | 8.89 mm | 0.35 in | 3 A | 15 | 0.76 Ám | 30 Áin | Board Edge Right Angle Through Hole | 1 | Plug Male Pins | (DE E) High Density | -55 C | 125 °C | Polyester Thermoplastic | Copper Alloy | |||
EDAC Inc. | D-Sub High Density | Board Lock Grounding Indents Mounting Brackets Shielded | Signal | 3 | Nickel Plated Steel | Housing/Shell (Unthreaded) | Solder | UL94 V-0 | Gold | 8.89 mm | 0.35 in | 3 A | 15 | Board Edge Right Angle Through Hole | 1 | Plug Male Pins | (DE E) High Density | -55 C | 125 °C | Polyester Thermoplastic | Copper Alloy | Flash | |||||
EDAC Inc. | D-Sub High Density | Board Lock Grounding Indents Mounting Brackets Shielded | Signal | 3 | Nickel Plated Steel | 4-40 | Solder | UL94 V-0 | Gold | 8.89 mm | 0.35 in | 3 A | 44 | 0.38 µm | 15 µin | Board Edge Right Angle Through Hole | Plug Male Pins | 3 | |||||||||
EDAC Inc. | D-Sub High Density | Board Lock Grounding Indents Mounting Brackets Shielded | Signal | 3 | Nickel Plated Steel | 4-40 | Solder | UL94 V-0 | Gold | 8.89 mm | 0.35 in | 3 A | 44 | 0.76 Ám | 30 Áin | Board Edge Right Angle Through Hole | Plug Male Pins | -55 C | 125 °C | Polyester Thermoplastic | Copper Alloy | 3 | |||||
EDAC Inc. | D-Sub High Density | Grounding Indents Mounting Brackets Shielded | Signal | 3 | Nickel Plated Steel | 4-40 Mating Side Female Screwlock | Solder | UL94 V-0 | Gold | 8.89 mm | 0.35 in | 3 A | 15 | 0.76 Ám | 30 Áin | Board Edge Right Angle Through Hole | 1 | Plug Male Pins | (DE E) High Density |