NCSW Series
Manufacturer: Chip Quik Inc.
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
| Part | Composition | Melting Point [Max] | Melting Point [Max] | Melting Point [Min] | Melting Point [Min] | Flux Type | Type | Diameter [diameter] | Diameter [diameter] | Form | Form | Form | Form |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 428 °F | 220 °C | 423 °F | 217 °C | No-Clean | Wire Solder | 0.38 mm | 0.015 in | 113.4 g | 4 oz | Spool | |
Chip Quik Inc. | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 428 °F | 220 °C | 423 °F | 217 °C | No-Clean | Wire Solder | 0.38 mm | 0.015 in | 226.8 g | 8 oz | Spool | |
Chip Quik Inc. | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 428 °F | 220 °C | 423 °F | 217 °C | No-Clean | Wire Solder | 0.38 mm | 0.015 in | 56.7 g | 2 oz | Spool | |
Chip Quik Inc. | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 428 °F | 220 °C | 423 °F | 217 °C | No-Clean | Wire Solder | 0.38 mm | 0.015 in | 16 oz | 1 lb | Spool | |
Chip Quik Inc. | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 428 °F | 220 °C | 423 °F | 217 °C | No-Clean | Wire Solder | 0.38 mm | 0.015 in | 5.66 g | 0.2 oz | Tube | |
Chip Quik Inc. | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 428 °F | 220 °C | 423 °F | 217 °C | No-Clean | Wire Solder | 0.38 mm | 0.015 in | 1 oz | Spool | 28.35 g |