224 Series

Catalog

IC & COMPONENT SOCKET, 24 CONTACTS, QFN TEST SOCKET, 0.5 MM, 224 SERIES, BERYLLIUM COPPER

Part	Termination Post Length	Termination Post Length	Contact Resistance	Termination	Number of Positions or Pins (Grid)	Type	Contact Finish - Post	Mounting Type	Pitch - Mating	Pitch - Mating	Housing Material	Contact Material - Mating	Contact Finish - Mating	Contact Material - Post	Material Flammability Rating	Current Rating (Amps)	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Type	Type	Operating Temperature [Min]	Operating Temperature [Max]	Termination Post Length	Number of Pins	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Convert From (Adapter End) [custom]	Convert From (Adapter End) [custom]
3M Electronic Specialty 224-5205-01	3 mm	0.118 in	25 mOhm	Solder	24	QFN	Gold	Through Hole	0.5 mm	0.02 in	Polyethersulfone (PES)	Beryllium Copper	Gold	Beryllium Copper
3M Electronic Specialty 224-5248-00-0602J	2.78 mm	0.11 in	15 mOhm	Press-Fit	24	DIP ZIF (ZIP)	Gold	Connector	2.54 mm	0.1 "	Polysulfone (PSU) Glass Filled	Beryllium Copper	Gold	Beryllium Copper	UL94 V-0	1 A	12	2	30 µin	0.76 µm	Closed Frame	0.76 Ám	30 Áin	0.1 in	2.54 mm	7.62 mm	0.3 in	-55 C	125 °C
3M Electronic Specialty 224-1275-19-0602J	0.62 in			Wire Wrap			Gold	Through Hole	2.54 mm	0.1 "	Polysulfone (PSU) Glass Filled	Beryllium Copper	Gold	Beryllium Copper	UL94 V-0	1 A			30 µin	0.76 µm	Closed Frame	0.76 Ám	30 Áin	0.1 in	2.54 mm			-55 C	125 °C	15.75 mm	24	15.24 mm	DIP	0.6 in	15.24 mm	0.6 in	DIP
3M Electronic Specialty 224-5248-19-0602J				Solder			Gold	Through Hole	2.54 mm	0.1 "	Polysulfone (PSU) Glass Filled	Beryllium Copper	Gold	Beryllium Copper	UL94 V-0	1 A			30 µin	0.76 µm		0.76 Ám	30 Áin	0.1 in	2.54 mm			-55 C	125 °C		24		DIP		7.62 mm	0.3 in	DIP	0.3 in	7.62 mm
3M Electronic Specialty 224-1275-29-0602J	3.3 mm	0.13 in		Solder			Gold	Through Hole	2.54 mm	0.1 "	Polysulfone (PSU) Glass Filled	Beryllium Copper	Gold	Beryllium Copper	UL94 V-0	1 A			30 µin	0.76 µm	Closed Frame	0.76 Ám	30 Áin	0.1 in	2.54 mm			-55 C	125 °C		24	15.24 mm	DIP	0.6 in	15.24 mm	0.6 in	DIP