FOD3184 Series

3A Output Current, High Speed MOSFET/IGBT Gate Driver Optocoupler

Catalog

3A Output Current, High Speed MOSFET/IGBT Gate Driver Optocoupler

Part	Common Mode Transient Immunity (Min) [Min]	Current - DC Forward (If) (Max) [Max]	Pulse Width Distortion (Max) [Max]	Approval Agency	Current - Output High, Low [custom]	Current - Output High, Low [custom]	Supplier Device Package	Current - Peak Output	Number of Channels	Voltage - Output Supply [Min]	Voltage - Output Supply [Max]	Voltage - Forward (Vf) (Typ)	Rise / Fall Time (Typ) [custom]	Rise / Fall Time (Typ) [custom]	Technology	Propagation Delay tpLH / tpHL (Max) [Max] [y]	Propagation Delay tpLH / tpHL (Max) [Max] [x]	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Package / Case	Package / Case	Package / Case
ON Semiconductor FOD3184SV	35 kV/µs	25 mA	65 ns	IEC/EN/DIN UL	2.5 A	2.5 A	8-SMD	3 A	1	15 V	30 V	1.43 V	38 ns	24 ns	Optical Coupling	210 ns	210 ns	100 °C	-40 °C	Surface Mount
ON Semiconductor FOD3184SV	35 kV/µs	25 mA	65 ns	IEC/EN/DIN UL	2.5 A	2.5 A	8-SMD	3 A	1	15 V	30 V	1.43 V	38 ns	24 ns	Optical Coupling	210 ns	210 ns	100 °C	-40 °C	Surface Mount
ON Semiconductor FOD3184TSR2V	35 kV/µs	25 mA	65 ns	IEC/EN/DIN UL	2.5 A	2.5 A	8-SMD	3 A	1	15 V	30 V	1.43 V	38 ns	24 ns	Optical Coupling	210 ns	210 ns	100 °C	-40 °C	Surface Mount
ON Semiconductor FOD3184SD	35 kV/µs	25 mA	65 ns	UL	2.5 A	2.5 A	8-SMD	3 A	1	15 V	30 V	1.43 V	38 ns	24 ns	Optical Coupling	210 ns	210 ns	100 °C	-40 °C	Surface Mount
ON Semiconductor FOD3184TSV	35 kV/µs	25 mA	65 ns	IEC/EN/DIN UL	2.5 A	2.5 A	8-SMD	3 A	1	15 V	30 V	1.43 V	38 ns	24 ns	Optical Coupling	210 ns	210 ns	100 °C	-40 °C	Surface Mount
ON Semiconductor FOD3184SDV	35 kV/µs	25 mA	65 ns	IEC/EN/DIN UL	2.5 A	2.5 A	8-SMD	3 A	1	15 V	30 V	1.43 V	38 ns	24 ns	Optical Coupling	210 ns	210 ns	100 °C	-40 °C	Surface Mount
ON Semiconductor FOD3184TSR2	35 kV/µs	25 mA	65 ns	UL	2.5 A	2.5 A	8-SMD	3 A	1	15 V	30 V	1.43 V	38 ns	24 ns	Optical Coupling	210 ns	210 ns	100 °C	-40 °C	Surface Mount
ON Semiconductor FOD3184V	35 kV/µs	25 mA	65 ns	IEC/EN/DIN UL	2.5 A	2.5 A	8-DIP	3 A	1	15 V	30 V	1.43 V	38 ns	24 ns	Optical Coupling	210 ns	210 ns	100 °C	-40 °C	Through Hole	0.3 in	8-DIP	7.62 mm
ON Semiconductor FOD3184TSD	35 kV/µs	25 mA	65 ns	UL	2.5 A	2.5 A	8-SMD	3 A	1	15 V	30 V	1.43 V	38 ns	24 ns	Optical Coupling	210 ns	210 ns	100 °C	-40 °C	Surface Mount
ON Semiconductor FOD3184TSDV	35 kV/µs	25 mA	65 ns	IEC/EN/DIN UL	2.5 A	2.5 A	8-SMD	3 A	1	15 V	30 V	1.43 V	38 ns	24 ns	Optical Coupling	210 ns	210 ns	100 °C	-40 °C	Surface Mount

Catalog

3A Output Current, High Speed MOSFET/IGBT Gate Driver Optocoupler

Key Features

• High noise immunity characterized by 35kV/µs common mode rejection

• Guaranteed operating temperature range of -40°C to 100°C

• 3A minimum peak output current for medium power MOSFET/IGBT

• Fast switching speed

• 210ns max. propagation delay

• 65ns max. pulse width distortion

• Fast output rise/fall time

• Offers lower dynamic power dissipation

• 250kHZ maximum switching speed

• Wide VCCoperating range from 15V to 30V

• Use of P-Channel MOSFETs at output stage enables output voltage swing close to the supply rail (rail-to-rail output)

• Under voltage lockout protection (UVLO) with hysteresis - optimized for driving IGBTs

• Safety and regulatory approvals

• UL1577, 3,750 VACRMSfor 1 min.

• Minimum creepage distance of 8.0mm

• IEC60747-5-2, 1,414 peak working insulation voltage (pending approval)

• Minimum insulation thickness of 0.5mm

• Minimum clearance distance of 8.0mm (Option T)

Description

The FOD3184 is a 3A output current, high-speed MOSFET/IGBT gate drive optocoupler. It consists of an aluminium gallium arsenide (AlGaAs) light emitting diode (LED) optically coupled to a CMOS detector with PMOS and NMOS output power transistors integrated circuit power stage. It is ideally suited for high-frequency driving of power MOSFETS/IGBT used in Plasma Display Panels (PDPs), motor control inverter applications, and high-performance DC-DC converters.The device is packaged in an 8-pin dual in-line housing compatible with 260°C reflow processes for lead-free solder compliance.