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SOCKET IC OPEN LOWPRO .400 20POS

PartContact Finish Thickness - PostContact Finish Thickness - PostContact Finish - MatingContact Material - PostFeaturesContact ResistanceContact Finish - PostPitch - PostPitch - PostMaterial Flammability RatingPitch - MatingPitch - MatingTermination Post Length [x]Termination Post Length [x]TypeTypeTypeCurrent Rating (Amps)TerminationHousing MaterialContact Finish Thickness - MatingContact Finish Thickness - MatingMounting TypeOperating Temperature [Min]Operating Temperature [Max]Contact Material - MatingNumber of Positions or Pins (Grid)Number of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]
Mill-Max Manufacturing Corp.
200 µin
5.08 µm
Gold
Brass Alloy
Open Frame
10 mOhm
Tin-Lead
2.54 mm
0.1 in
UL94 V-0
0.1 in
2.54 mm
0.108 in
2.74 mm
0.3 "
7.62 mm
DIP
3 A
Solder
Thermoplastic
10 çin
0.25 çm
Through Hole
-55 °C
125 °C
Beryllium Copper
20
Mill-Max Manufacturing Corp.
200 µin
5.08 µm
Gold
Brass Alloy
Open Frame
10 mOhm
Tin-Lead
2.54 mm
0.1 in
UL94 V-0
0.1 in
2.54 mm
0.108 in
2.74 mm
0.3 "
7.62 mm
DIP
3 A
Solder
Polycyclohexylenedimethylene Terephthalate (PCT)
Polyester
10 çin
0.25 çm
Through Hole
-55 °C
125 °C
Beryllium Copper
24
Mill-Max Manufacturing Corp.
200 µin
5.08 µm
Gold
Brass Alloy
Open Frame
10 mOhm
Tin-Lead
2.54 mm
0.1 in
UL94 V-0
0.1 in
2.54 mm
0.108 in
2.74 mm
0.6 in
15.24 mm
DIP
3 A
Solder
Polycyclohexylenedimethylene Terephthalate (PCT)
Polyester
10 çin
0.25 çm
Through Hole
-55 °C
125 °C
Beryllium Copper
28
Mill-Max Manufacturing Corp.
200 µin
5.08 µm
Gold
Brass Alloy
Open Frame
10 mOhm
Tin-Lead
2.54 mm
0.1 in
UL94 V-0
0.1 in
2.54 mm
0.108 in
2.74 mm
0.6 in
15.24 mm
DIP
3 A
Solder
Polycyclohexylenedimethylene Terephthalate (PCT)
Polyester
10 çin
0.25 çm
Through Hole
-55 °C
125 °C
Beryllium Copper
Mill-Max Manufacturing Corp.
200 µin
5.08 µm
Gold
Brass Alloy
Open Frame
10 mOhm
Tin-Lead
2.54 mm
0.1 in
UL94 V-0
0.1 in
2.54 mm
0.108 in
2.74 mm
0.3 "
7.62 mm
DIP
3 A
Solder
Thermoplastic
10 çin
0.25 çm
Through Hole
-55 °C
125 °C
Beryllium Copper
2
6
3
Mill-Max Manufacturing Corp.
200 µin
5.08 µm
Gold
Brass Alloy
Open Frame
10 mOhm
Tin-Lead
2.54 mm
0.1 in
UL94 V-0
0.1 in
2.54 mm
0.108 in
2.74 mm
0.4 in
10.16 mm
DIP
3 A
Solder
Thermoplastic
10 çin
0.25 çm
Through Hole
-55 °C
125 °C
Beryllium Copper
22
Mill-Max Manufacturing Corp.
200 µin
5.08 µm
Gold
Brass Alloy
Open Frame
10 mOhm
Tin-Lead
2.54 mm
0.1 in
UL94 V-0
0.1 in
2.54 mm
0.108 in
2.74 mm
0.6 in
15.24 mm
DIP
3 A
Solder
Thermoplastic
10 çin
0.25 çm
Through Hole
-55 °C
125 °C
Beryllium Copper
Mill-Max Manufacturing Corp.
200 µin
5.08 µm
Gold
Brass Alloy
Open Frame
10 mOhm
Tin-Lead
2.54 mm
0.1 in
UL94 V-0
0.1 in
2.54 mm
0.108 in
2.74 mm
0.3 "
7.62 mm
DIP
3 A
Solder
Thermoplastic
10 çin
0.25 çm
Through Hole
-55 °C
125 °C
Beryllium Copper
18
115-91-320-41-003000
Mill-Max Manufacturing Corp.
200 µin
5.08 µm
Gold
Brass Alloy
Open Frame
10 mOhm
Tin-Lead
2.54 mm
0.1 in
UL94 V-0
0.1 in
2.54 mm
0.108 in
2.74 mm
0.3 "
7.62 mm
DIP
3 A
Solder
Thermoplastic
10 çin
0.25 çm
Through Hole
-55 °C
125 °C
Beryllium Copper
20
Mill-Max Manufacturing Corp.
200 µin
5.08 µm
Gold
Brass Alloy
Open Frame
10 mOhm
Tin-Lead
2.54 mm
0.1 in
UL94 V-0
0.1 in
2.54 mm
0.108 in
2.74 mm
0.3 "
7.62 mm
DIP
3 A
Solder
Thermoplastic
10 çin
0.25 çm
Through Hole
-55 °C
125 °C
Beryllium Copper
16