612-91 Series

Manufacturer: Mill-Max Manufacturing Corp.

Catalog

SKT CARRIER SOLDRTL

Part	Contact Resistance	Material Flammability Rating	Current Rating (Amps)	Termination Post Length [x]	Termination Post Length [x]	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Housing Material	Contact Material - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Finish - Mating	Termination	Features	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Post	Mounting Type	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type [custom]	Type [custom]	Type	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]	Type	Type	Number of Positions or Pins (Grid) [custom]
Mill-Max Manufacturing Corp. 612-91-632-41-003000	10 mOhm	UL94 V-0	3 A	0.183 in	4.65 mm	0.1 "	2.54 mm	32	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Brass Alloy	0.25 µm	10 µin	Beryllium Copper	Gold	Solder	Carrier Open Frame	-55 C	125 °C	Tin-Lead	Through Hole	0.1 in	2.54 mm	200 µin	5.08 µm	15.24 mm	0.6 in	DIP
Mill-Max Manufacturing Corp. 612-91-322-41-004000	10 mOhm	UL94 V-0	3 A			0.1 "	2.54 mm	22	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Brass Alloy	0.25 µm	10 µin	Beryllium Copper	Gold	Solder	Carrier Open Frame	-55 C	125 °C	Tin-Lead	Through Hole	0.1 in	2.54 mm	200 µin	5.08 µm			DIP	6.93 mm	0.273 "	11	2	7.62 mm	0.3 in
Mill-Max Manufacturing Corp. 612-91-624-41-001000	10 mOhm	UL94 V-0	3 A			0.1 "	2.54 mm	24	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Brass Alloy	0.25 µm	10 µin	Beryllium Copper	Gold	Solder	Carrier Open Frame	-55 C	125 °C	Tin-Lead	Through Hole	0.1 in	2.54 mm	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	3.15 mm	0.124 in	2	12
Mill-Max Manufacturing Corp. 612-91-420-41-004000	10 mOhm	UL94 V-0	3 A			0.1 "	2.54 mm	20	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Brass Alloy	0.25 µm	10 µin	Beryllium Copper	Gold	Solder	Carrier Open Frame	-55 C	125 °C	Tin-Lead	Through Hole	0.1 in	2.54 mm	200 µin	5.08 µm			DIP	6.93 mm	0.273 "				0.4 in
Mill-Max Manufacturing Corp. 612-91-640-41-003000	10 mOhm	UL94 V-0	3 A	0.183 in	4.65 mm	0.1 "	2.54 mm	40	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Brass Alloy	0.25 µm	10 µin	Beryllium Copper	Gold	Solder	Carrier Open Frame	-55 C	125 °C	Tin-Lead	Through Hole	0.1 in	2.54 mm	200 µin	5.08 µm	15.24 mm	0.6 in	DIP
Mill-Max Manufacturing Corp. 612-91-640-41-004000	10 mOhm	UL94 V-0	3 A			0.1 "	2.54 mm	40	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Brass Alloy	0.25 µm	10 µin	Beryllium Copper	Gold	Solder	Carrier Open Frame	-55 C	125 °C	Tin-Lead	Through Hole	0.1 in	2.54 mm	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	6.93 mm	0.273 "
Mill-Max Manufacturing Corp. 612-91-306-41-003000	10 mOhm	UL94 V-0	3 A	0.183 in	4.65 mm	0.1 "	2.54 mm	6	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Brass Alloy	0.25 µm	10 µin	Beryllium Copper	Gold	Solder	Carrier Open Frame	-55 C	125 °C	Tin-Lead	Through Hole	0.1 in	2.54 mm	200 µin	5.08 µm			DIP			3 positions or pins	2	7.62 mm	0.3 in
Mill-Max Manufacturing Corp. 612-91-428-41-004000	10 mOhm	UL94 V-0	3 A			0.1 "	2.54 mm	28	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Brass Alloy	0.25 µm	10 µin	Beryllium Copper	Gold	Solder	Carrier Open Frame	-55 C	125 °C	Tin-Lead	Through Hole	0.1 in	2.54 mm	200 µin	5.08 µm			DIP	6.93 mm	0.273 "				0.4 in
Mill-Max Manufacturing Corp. 612-91-306-41-004000	10 mOhm	UL94 V-0	3 A			0.1 "	2.54 mm	6	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Brass Alloy	0.25 µm	10 µin	Beryllium Copper	Gold	Solder	Carrier Open Frame	-55 C	125 °C	Tin-Lead	Through Hole	0.1 in	2.54 mm	200 µin	5.08 µm			DIP	6.93 mm	0.273 "	3 positions or pins	2	7.62 mm	0.3 in
Mill-Max Manufacturing Corp. 612-91-650-41-003000	10 mOhm	UL94 V-0	3 A	0.183 in	4.65 mm	0.1 "	2.54 mm		Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Brass Alloy	0.25 µm	10 µin	Beryllium Copper	Gold	Solder	Carrier Open Frame	-55 C	125 °C	Tin-Lead	Through Hole	0.1 in	2.54 mm	200 µin	5.08 µm	15.24 mm	0.6 in	DIP			25	2			50