240 Series

Catalog

IC & COMPONENT SOCKET, 40 CONTACTS, DIP SOCKET, 2.54 MM, 240 SERIES, 15.24 MM, BERYLLIUM COPPER

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Resistance	Contact Material - Mating	Number of Positions or Pins (Grid)	Contact Material - Post	Housing Material	Mounting Type	Contact Finish - Mating	Pitch - Post	Pitch - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Type	Type	Termination	Features	Pitch - Mating	Pitch - Mating	Termination Post Length	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Number of Pins	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]
3M Electronic Specialty 240-1280-00-0602J	0.11 in	2.78 mm	UL94 V-0	1 A	15 mOhm	Beryllium Copper	40	Beryllium Copper	Polysulfone (PSU) Glass Filled	Connector	Gold	0.1 in	2.54 mm	-55 C	125 °C	30 µin	0.76 µm	0.76 Ám	30 Áin	Gold	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Press-Fit	Closed Frame	0.1 "	2.54 mm
3M Electronic Specialty 240-1280-19-0602J		0.62 in	UL94 V-0	1 A		Beryllium Copper		Beryllium Copper	Polysulfone (PSU) Glass Filled	Through Hole	Gold	0.1 in	2.54 mm	-55 C	125 °C	30 µin	0.76 µm	0.76 Ám	30 Áin	Gold			Wire Wrap	Closed Frame	0.1 "	2.54 mm	15.75 mm	15.24 mm	DIP	0.6 in	15.24 mm	0.6 in	DIP	40 pins
3M Electronic Specialty 240-5205-01	0.118 in	3 mm			25 mOhm	Beryllium Copper	40	Beryllium Copper	Polyethersulfone (PES)	Through Hole	Gold									Gold	QFN		Solder	Closed Frame											4	10
3M Electronic Specialty 240-1280-29-0602J	0.13 in	3.3 mm	UL94 V-0	1 A		Beryllium Copper		Beryllium Copper	Polysulfone (PSU) Glass Filled	Through Hole	Gold	0.1 in	2.54 mm	-55 C	125 °C	30 µin	0.76 µm	0.76 Ám	30 Áin	Gold			Solder	Closed Frame	0.1 "	2.54 mm		15.24 mm	DIP	0.6 in	15.24 mm	0.6 in	DIP	40 pins
3M Electronic Specialty 240-3639-19-0602J		0.62 in	UL94 V-0	1 A		Beryllium Copper		Beryllium Copper	Polysulfone (PSU) Glass Filled	Through Hole	Gold	0.1 in	2.54 mm	-55 C	125 °C	30 µin	0.76 µm	0.76 Ám	30 Áin	Gold			Wire Wrap	Closed Frame	0.1 "	2.54 mm	15.75 mm	25.4 mm	DIP	1 "	25.4 mm	1 "	DIP	40 pins
3M Electronic Specialty 240-5205-00	0.118 in	3 mm			25 mOhm	Beryllium Copper	40	Beryllium Copper	Polyethersulfone (PES)	Through Hole	Gold									Gold	QFN		Solder	Closed Frame											4	10
3M Electronic Specialty 240-3639-09-0602J	0.13 in	3.3 mm	UL94 V-0	1 A		Beryllium Copper		Beryllium Copper	Polysulfone (PSU) Glass Filled	Through Hole	Gold	0.1 in	2.54 mm	-55 C	125 °C	30 µin	0.76 µm	0.76 Ám	30 Áin	Gold			Solder	Closed Frame	0.1 "	2.54 mm		25.4 mm	DIP	1 "	25.4 mm	1 "	DIP	40 pins
3M Electronic Specialty 240-1280-09-0602J	0.13 in	3.3 mm	UL94 V-0	1 A		Beryllium Copper		Beryllium Copper	Polysulfone (PSU) Glass Filled	Through Hole	Gold	0.1 in	2.54 mm	-55 C	125 °C	30 µin	0.76 µm	0.76 Ám	30 Áin	Gold			Solder		0.1 "	2.54 mm		15.24 mm	DIP	0.6 in	15.24 mm	0.6 in	DIP	40 pins