WS991 Series
Manufacturer: Chip Quik Inc.
Beta
⌘K
SOLDER PASTE THERMALLY STABLE WS
| Part | Shelf Life Start | Flux Type | Mesh Type | Melting Point | Melting Point | Type | Form | Form | Composition | Shelf Life | Composition | Process |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | Date of Manufacture | Water Soluble | 4 | 138 °C | 281 °F | Solder Paste | 17.64 oz 500 g | Jar | 0.4 % 42 % 57.6 % | 6 Months | ||
 Chip Quik Inc. | Date of Manufacture | Water Soluble | 4 | 217 °C | 423 °F | Solder Paste | 17.64 oz 500 g | Jar | 6 Months | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | ||
 Chip Quik Inc. | Date of Manufacture | Water Soluble | 4 | 361 °F | Solder Paste | 17.64 oz 500 g | Jar | 6 Months | Leaded |