HMC554 Series
10 GHz to 20 GHz, GaAs, MMIC, Double Balanced Mixer
Manufacturer: Analog Devices Inc./Maxim Integrated
Catalog
10 GHz to 20 GHz, GaAs, MMIC, Double Balanced Mixer
| Part | Number of Mixers | Noise Figure | RF Type | Frequency [Max] | Frequency [Min] | Secondary Attributes | Package / Case | Supplier Device Package | Mounting Type | Supplier Device Package [x] | Supplier Device Package [y] | Contents | Type | Utilized IC / Part |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Analog Devices Inc./Maxim Integrated | 1 | 8 dB | VSAT | 20 GHz | 10 GHz | Up/Down Converter | ||||||||
 Analog Devices Inc./Maxim Integrated | 1 | 8 dB | VSAT | 20 GHz | 11 GHz | Up/Down Converter | Die | Die | Surface Mount | |||||
 Analog Devices Inc./Maxim Integrated | 1 | 8 dB | VSAT | 20 GHz | 11 GHz | 12-CLCC Exposed Pad | 12-CLCC | Surface Mount | 2.9 | 2.9 | ||||
 Analog Devices Inc./Maxim Integrated | 12-VFCQFN Exposed Pad | 12-CSMT (3x3) | Surface Mount | |||||||||||
Analog Devices Inc./Maxim Integrated | 1 | 8 dB | General Purpose | 20 GHz | 11 GHz | Up/Down Converter | 12-VFCQFN Exposed Pad | 12-CSMT (3x3) | Surface Mount | |||||
Analog Devices Inc./Maxim Integrated | 1 | 8 dB | General Purpose | 20 GHz | 11 GHz | Up/Down Converter | 12-VFCQFN Exposed Pad | 12-CSMT (3x3) | Surface Mount | |||||
 Analog Devices Inc./Maxim Integrated | 20 GHz | 10 GHz | Board(s) | Mixer | HMC554ALC3B | |||||||||
Analog Devices Inc./Maxim Integrated | 1 | 8 dB | VSAT | 20 GHz | 11 GHz | 12-CLCC Exposed Pad | 12-CLCC | Surface Mount | 2.9 | 2.9 | ||||
 Analog Devices Inc./Maxim Integrated | 1 | 8 dB | VSAT | 20 GHz | 10 GHz | Up/Down Converter | Die | Die |
Description
AI
The HMC554 devices are passive (HMC554) and general purpose (HMC554LC3B) double-balanced mixers that are available in a chip (HMC554) and a leadless RoHS compliant SMT package (HMC554LC3B), both of which can be used as an upconverter or downconverter between 11 GHz and 20 GHz. These mixers are fabricated in a GaAs metal semiconductor field effect transistor (MESFET) process, and require no external components or matching circuitry. The HMC554G devices provide excellent LO to RF and LO to IF isolation due to optimized balun structures. Measurements were made with the HMC554 chip mounted into in a 50 Ω test fixture and includes the parasitic effects of wire bond assembly. Connections were made with a 1 mil wire bond with minimal length (<12 mil). The RoHS compliant HMC554LC3B eliminates the need for wire bonding, and is compatible with high volume surface mount manufacturing techniques.ApplicationsPoint-to-point radiosPoint-to-multipoint radiosTest equipment and sensorsMilitary end useMicrowave radioSpaceCommunications, radar, and electronic warfare (EW)